参数资料
型号: MT46V32M8BG-6AT:G
元件分类: DRAM
英文描述: 32M X 8 DDR DRAM, 0.7 ns, PBGA60
封装: (8 X 14) MM, LEAD FREE,PLASTIC, FBGA-60
文件页数: 18/93页
文件大小: 3632K
PDF: 09005aef80768abb/Source: 09005aef82a95a3a
Micron Technology, Inc., reserves the right to change products or specifications without notice.
DDR_x4x8x16_Core2.fm - 256Mb DDR: Rev. O, Core DDR: Rev. B 1/09 EN
23
2003 Micron Technology, Inc. All rights reserved.
256Mb: x4, x8, x16 DDR SDRAM
Electrical Specifications – DC and AC
Table 18:
Electrical Characteristics and Recommended AC Operating Conditions (-5B)
Notes 1–6, 16–18, 34 apply to the entire table; Notes appear on page 35;
0°C
≤ T
A ≤ +70°C; VDDQ = +2.6V ±0.1V, VDD = +2.6V ±0.1V
AC Characteristics
-5B
Units
Notes
Parameter
Symbol
Min
Max
Access window of DQ from CK/CK#
tAC
–0.70
+0.70
ns
CK high-level width
tCH
0.45
0.55
tCK
Clock cycle time
CL = 3
tCK (3)
5
7.5
ns
CL = 2.5
tCK (2.5)
6
13
ns
CL = 2
tCK (2)
7.5
13
ns
CK low-level width
tCL
0.45
0.55
tCK
DQ and DM input hold time relative to DQS
tDH
0.40
ns
DQ and DM input pulse width (for each input)
tDIPW
1.75
ns
Access window of DQS from CK/CK#
tDQSCK
–0.60
+0.60
ns
DQS input high pulse width
tDQSH
0.35
tCK
DQS input low pulse width
tDQSL
0.35
tCK
DQS–DQ skew, DQS to last DQ valid, per group, per access
tDQSQ
0.40
ns
WRITE command to first DQS latching transition
tDQSS
0.72
1.28
tCK
DQ and DM input setup time relative to DQS
tDS
0.40
ns
DQS falling edge from CK rising – hold time
tDSH
0.2
tCK
DQS falling edge to CK rising – setup time
tDSS
0.2
tCK
Half-clock period
tHP
tCH,tCL
ns
Data-out High-Z window from CK/CK#
tHZ
+0.70
ns
Address and control input hold time (slew rate
≥0.5 V/ns)
tIH
F
0.60
ns
Address and control input pulse width (for each input)
tIPW
2.2
ns
Address and control input setup time (slew rate
≥0.5 V/ns)
tIS
F
0.60
ns
Data-out Low-Z window from CK/CK#
tLZ
–0.70
ns
LOAD MODE REGISTER command cycle time
tMRD
10
ns
DQ–DQS hold, DQS to first DQ to go non-valid, per access
tQH
tHP -tQHS
ns
Data hold skew factor
tQHS
0.50
ns
ACTIVE-to-READ with auto precharge command
tRAP
15
ns
ACTIVE-to-PRECHARGE command
tRAS
40
70,000
ns
ACTIVE-to-ACTIVE/AUTO REFRESH command period
tRC
55
ns
ACTIVE-to-READ or WRITE delay
tRCD
15
ns
REFRESH-to-REFRESH command interval
tREFC
70.3
s
REFRESH-to-REFRESH command interval (Automotive)
tREFC
AT
17.55
s
Average periodic refresh interval
tREFI
7.8
s
Average periodic refresh interval (Automotive)
tREFI
AT
–1.95
s
AUTO REFRESH command period
tRFC
70
ns
PRECHARGE command period
tRP
15
ns
DQS read preamble
tRPRE
0.9
1.1
tCK
DQS read postamble
tRPST
0.4
0.6
tCK
ACTIVE bank a to ACTIVE bank b command
tRRD
10
ns
Terminating voltage delay to VDD
tVTD
0
ns
DQS write preamble
tWPRE
0.25
tCK
DQS write preamble setup time
tWPRES
0
ns
DQS write postamble
tWPST
0.4
0.6
tCK
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