Pentium III Processor for the PGA370 Socket up to 750MHz
4
Datasheet
3.4
Non-AGTL+ Signal Quality Specifications and Measurement Guidelines........... 40
3.4.1
Overshoot/Undershoot Guidelines ......................................................... 41
3.4.2
Ringback Specification ........................................................................... 41
3.4.3
Settling Limit Guideline .......................................................................... 41
4.0
Thermal Specifications and Design Considerations......................................................... 42
4.1
Thermal Specifications........................................................................................ 42
4.1.1
Thermal Diode........................................................................................ 43
5.0
Mechanical Specifications............................................................................................... 44
5.1
FC-PGA Mechanical Specifications .................................................................... 44
5.2
Processor Markings ............................................................................................ 46
5.3
Processor Signal Listing...................................................................................... 46
6.0
Boxed Processor Specifications....................................................................................... 58
6.1
Mechanical Specifications................................................................................... 58
6.1.1
Boxed Processor Thermal Cooling Solution Dimensions....................... 58
6.1.2
Boxed Processor Heatsink Weight......................................................... 60
6.1.3
Boxed Processor Thermal Cooling Solution Clip ................................... 60
6.1.4
Heatsink Grounding for the Boxed Processor ........................................ 61
6.2
Boxed Processor Requirements ......................................................................... 61
6.2.1
Fan Heatsink Power Supply ................................................................... 61
6.3
Thermal Specifications........................................................................................ 62
6.3.1
Boxed Processor Cooling Requirements ............................................... 62
7.0
Processor Signal Description ........................................................................................... 64
7.1
Alphabetical Signals Reference .......................................................................... 64
7.2
Signal Summaries ............................................................................................... 71