- 您现在的位置：买卖IC网 > PDF目录69321 > RB80526PZ667256 (INTEL CORP) 64-BIT, 667 MHz, MICROPROCESSOR, CPGA370 PDF资料下载
参数资料
| 型号： | RB80526PZ667256 |
| 厂商： | INTEL CORP |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 64-BIT, 667 MHz, MICROPROCESSOR, CPGA370 |
| 封装： | FCPGA-370 |
| 文件页数： | 40/74页 |
| 文件大小： | 502K |
| 代理商： | RB80526PZ667256 |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页第30页第31页第32页第33页第34页第35页第36页第37页第38页第39页当前第40页第41页第42页第43页第44页第45页第46页第47页第48页第49页第50页第51页第52页第53页第54页第55页第56页第57页第58页第59页第60页第61页第62页第63页第64页第65页第66页第67页第68页第69页第70页第71页第72页第73页第74页
Datasheet
45
Pentium III Processor for the PGA370 Socket up to 750 MHz
NOTES:
1. Capacitors will be placed on the pin-side of the FC-PGA package in the area defined by G1, G2, and G3.
This area is a keepout zone for motherboard designers.
The bare processor die has mechanical load limits that should not be exceeded during heat sink
assembly, mechanical stress testing, or standard drop and shipping conditions. The heatsink attach
solution must not induce permanent stress into the processor substrate with the exception of a
uniform load to maintain the heatsink to the processor thermal interface. The package dynamic and
static loading parameters are listed in Table 28.
For Table 28, the following apply:
1. It is not recommended to use any portion of the processor substrate as a mechanical reference
or load bearing surface for thermal solutions.
2. Parameters assume uniformly applied loads
NOTES:
1. This specification applies to a uniform and a non-uniform load.
2. This is the maximum static force that can be applied by the heatsink and clip to maintain the heatsink and
processor interface
Table 27. Intel Pentium III Processor Package Dimensions
Symbol
Millimeters
Inches
Minimum
Maximum
Notes
Minimum
Maximum
Notes
A1
0.787
0.889
0.031d
0.035
A2
1.000
1.200
0.039
0.047
B1
11.226
11.329
0.442
0.446
B2
9.296
9.398
0.366
0.370
C1
23.495 max
0.925 max
C2
21.590 max
0.850 max
D
49.428
49.632
1.946
1.954
D1
45.466
45.974
1.790
1.810
G1
0.000
17.780
0
0.700
G2
0.000
17.780
0
0.700
G3
0.000
0.889
0
0.035
H
2.540
Nominal
0.100
Nominal
L
3.048
3.302
0.120
0.130
ΦP
0.431
0.483
Pin Diameter
0.017
0.019
Pin TP
0.508 Diameteric True Position (Pin-to-Pin)
0.020 Diameteric True Position (Pin-to-Pin)
Table 28. Processor Die Loading Parameters
Parameter
Dynamic (max)1
Static (max)2
Unit
Silicon Die Surface
200
25
lbf
Silicon Die Edge
100
12
lbf
相关PDF资料 |
PDF描述 |
|---|---|
| RB80526RY001128 | 32-BIT, 1000 MHz, MICROPROCESSOR, CPGA370 |
| RB80526RX766128 | 32-BIT, 766 MHz, MICROPROCESSOR, CPGA370 |
| RC5C317B | REAL TIME CLOCK, PDSO14 |
| RC7102 | 133.3 MHz, PROC SPECIFIC CLOCK GENERATOR, PDSO48 |
| RC7108 | 150 MHz, PROC SPECIFIC CLOCK GENERATOR, PDSO48 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| RB80526PZ733256 | 制造商:Rochester Electronics LLC 功能描述:PIII 733/133 256K ON DIE FC-PGA - Bulk |
| RB80526PZ733256S L4CG | 制造商:Intel 功能描述:MPU Pentium 制造商:Intel 功能描述:MPU Pentium? III Processor 0.18um 733MHz 370-Pin FCPGA |
| RB80526PZ733256S L4ZL | 制造商:Intel 功能描述:MPU Pentium 制造商:Intel 功能描述:MPU Pentium? III Processor 0.18um 733MHz 370-Pin FCPGA |
| RB80526PZ800256 | 制造商:Rochester Electronics LLC 功能描述:PIII 800/133 256K ON DIE FC-PGA - Bulk |
| RB80526PZ866256 | 制造商:Rochester Electronics LLC 功能描述:PIII 866/133 256K ON DIE FC-PGA - Bulk |
发布紧急采购，3分钟左右您将得到回复。