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参数资料
| 型号： | RB80526PZ667256 |
| 厂商： | INTEL CORP |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 64-BIT, 667 MHz, MICROPROCESSOR, CPGA370 |
| 封装： | FCPGA-370 |
| 文件页数： | 54/74页 |
| 文件大小： | 502K |
| 代理商： | RB80526PZ667256 |
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58
Datasheet
Pentium III Processor for the PGA370 Socket up to 750 MHz
6.0
Boxed Processor Specifications
The Intel Pentium III processor for the PGA370 socket is also offered as an Intel boxed
processor. Intel boxed processors are intended for system integrators who build systems from
motherboards and standard components. The boxed Pentium III processor for the PGA370 socket
will be supplied with an unattached fan heatsink. This section documents motherboard and system
requirements for the fan heatsink that will be supplied with the boxed Pentium III processor. This
section is particularly important for OEMs that manufacture motherboards for system integrators.
Unless otherwise noted, all figures in this section are dimensioned in inches. Figure 21 shows a
mechanical representation of the boxed Intel Pentium III processor for the PGA370 socket in the
Flip Chip Pin Grid Array (FC-PGA) package.
Note:
Drawings in this section reflect only the specifications on the Intel Boxed Processor product. These
dimensions should not be used as a generic keep-out zone for all heatsinks. It is the system
designer’s responsibility to consider their proprietary solution when designing to the required keep-
out zone on their system platform and chassis. Refer to the Intel Pentium III processor Enabling
Functional Specification for further guidance. Contact your local Intel Sales Representative for this
document.
6.1
Mechanical Specifications
This section documents the mechanical specifications of the boxed Pentium III processor fan
heatsink.
6.1.1
Boxed Processor Thermal Cooling Solution Dimensions
The boxed processor ships with an unattached fan heatsink that has an integrated clip. Clearance is
required around the fan heatsink to ensure unimpeded airflow for proper cooling. Note that the
airflow of the fan heatsink is into the center and out of the sides of the fan heatsink. The dimensions
for the boxed processor with integrated fan heatsink are shown in Figure 22 and Figure 23. There
are two versions of the fan heatsink. The larger cooling solution (depicted on the right of Figure 22
and Figure 23 is required for Pentium III processors at frequencies of 700 MHz and above. General
spatial specifications are also outlined in Table 31. All dimensions are in inches.
Figure 21. Conceptual Boxed Intel Pentium III Processor for the PGA370 Socket
相关PDF资料 |
PDF描述 |
|---|---|
| RB80526RY001128 | 32-BIT, 1000 MHz, MICROPROCESSOR, CPGA370 |
| RB80526RX766128 | 32-BIT, 766 MHz, MICROPROCESSOR, CPGA370 |
| RC5C317B | REAL TIME CLOCK, PDSO14 |
| RC7102 | 133.3 MHz, PROC SPECIFIC CLOCK GENERATOR, PDSO48 |
| RC7108 | 150 MHz, PROC SPECIFIC CLOCK GENERATOR, PDSO48 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| RB80526PZ733256 | 制造商:Rochester Electronics LLC 功能描述:PIII 733/133 256K ON DIE FC-PGA - Bulk |
| RB80526PZ733256S L4CG | 制造商:Intel 功能描述:MPU Pentium 制造商:Intel 功能描述:MPU Pentium? III Processor 0.18um 733MHz 370-Pin FCPGA |
| RB80526PZ733256S L4ZL | 制造商:Intel 功能描述:MPU Pentium 制造商:Intel 功能描述:MPU Pentium? III Processor 0.18um 733MHz 370-Pin FCPGA |
| RB80526PZ800256 | 制造商:Rochester Electronics LLC 功能描述:PIII 800/133 256K ON DIE FC-PGA - Bulk |
| RB80526PZ866256 | 制造商:Rochester Electronics LLC 功能描述:PIII 866/133 256K ON DIE FC-PGA - Bulk |
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