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| 型号： | RB80526PZ667256 |
| 厂商： | INTEL CORP |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 64-BIT, 667 MHz, MICROPROCESSOR, CPGA370 |
| 封装： | FCPGA-370 |
| 文件页数： | 45/74页 |
| 文件大小： | 502K |
| 代理商： | RB80526PZ667256 |
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Datasheet
5
Pentium III Processor for the PGA370 Socket up to 750MHz
List of Figures
1
Second Level (L2) Cache Implementation ........................................................... 7
2
AGTL+ Bus Topology in a Uniprocessor Configuration ...................................... 12
3
Stop Clock State Machine ................................................................................... 12
4
Processor VccCMOS Package Routing ................................................................16
5
BSEL[1:0] Example for a 100/133 MHz or 100 MHz Only System Design ......... 20
6
BCLK, PICCLK, and TCK Generic Clock Waveform ........................................... 30
7
System Bus Valid Delay Timings ........................................................................ 30
8
System Bus Setup and Hold Timings.................................................................. 30
9
System Bus Reset and Configuration Timings.................................................... 31
10
Power-On Reset and Configuration Timings....................................................... 31
11
Test Timings (TAP Connection) .......................................................................... 32
12
Test Reset Timings ............................................................................................. 32
13
BCLK, PICCLK Generic Clock Waveform at the Processor Pins ........................34
14
Low to High AGTL+ Receiver Ringback Tolerance............................................. 35
15
Maximum Acceptable AGTL+ Overshoot/Undershoot Waveform ....................... 40
16
Non-AGTL+ Overshoot/Undershoot, Settling Limit, and Ringback .................... 40
17
Processor Functional Die Layout ........................................................................ 43
18
Package Dimensions........................................................................................... 44
19
Top Side Processor Markings ............................................................................. 46
20
Intel Pentium III Processor Pinout ................................................................... 47
21
Conceptual Boxed Intel Pentium III Processor for the PGA370 Socket .......... 58
22
Side View of Space Requirements for the Boxed Processor .............................. 59
23
Side View of Space Requirements for the Boxed Processor .............................. 59
24
Dimensions of Mechanical Step Feature in Heatsink Base................................. 60
25
Clip Keepout Requirements and Recommended EMI Ground Pad
Location for Boxed Intel Pentium III Processors ............................................. 60
26
Boxed Processor Fan Heatsink Power Cable Connector Description................. 61
27
Motherboard Power Header Placement Relative to the Boxed
Intel
Pentium III Processor ..............................................................................62
28
Thermal Airspace Requirement for all Boxed Intel
Pentium III Processor
Fan Heatsinks in the PGA370 Socket ................................................................. 63
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相关代理商/技术参数 |
参数描述 |
|---|---|
| RB80526PZ733256 | 制造商:Rochester Electronics LLC 功能描述:PIII 733/133 256K ON DIE FC-PGA - Bulk |
| RB80526PZ733256S L4CG | 制造商:Intel 功能描述:MPU Pentium 制造商:Intel 功能描述:MPU Pentium? III Processor 0.18um 733MHz 370-Pin FCPGA |
| RB80526PZ733256S L4ZL | 制造商:Intel 功能描述:MPU Pentium 制造商:Intel 功能描述:MPU Pentium? III Processor 0.18um 733MHz 370-Pin FCPGA |
| RB80526PZ800256 | 制造商:Rochester Electronics LLC 功能描述:PIII 800/133 256K ON DIE FC-PGA - Bulk |
| RB80526PZ866256 | 制造商:Rochester Electronics LLC 功能描述:PIII 866/133 256K ON DIE FC-PGA - Bulk |
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