参数资料
型号: RB80526PZ667256
厂商: INTEL CORP
元件分类: 微控制器/微处理器
英文描述: 64-BIT, 667 MHz, MICROPROCESSOR, CPGA370
封装: FCPGA-370
文件页数: 57/74页
文件大小: 502K
代理商: RB80526PZ667256
60
Datasheet
Pentium III Processor for the PGA370 Socket up to 750 MHz
6.1.2
Boxed Processor Heatsink Weight
The boxed processor thermal cooling solution will not weigh more than 180 grams.
6.1.3
Boxed Processor Thermal Cooling Solution Clip
The boxed processor thermal solution requires installation by a system integrator to secure the
thermal cooling solution to the processor after it is installed in the 370-pin socket ZIF socket.
Motherboards designed for use by system integrators should take care to consider the implications
of clip installation and potential scraping of the motherboard PCB underneath the 370-pin socket
attach tabs. Motherboard components should not be placed too close to the 370-pin socket attach
tabs in a way that interferes with the installation of the boxed processor thermal cooling solution
(see Figure 25 for specification).
Figure 24. Dimensions of Mechanical Step Feature in Heatsink Base
0.472
0.043
Figure 25. Clip Keepout Requirements and Recommended EMI Ground Pad Location for
Boxed Intel Pentium III Processors
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