参数资料
型号: RB80526PZ667256
厂商: INTEL CORP
元件分类: 微控制器/微处理器
英文描述: 64-BIT, 667 MHz, MICROPROCESSOR, CPGA370
封装: FCPGA-370
文件页数: 58/74页
文件大小: 502K
代理商: RB80526PZ667256
Datasheet
61
Pentium III Processor for the PGA370 Socket up to 750 MHz
6.1.4
Heatsink Grounding for the Boxed Processor
Intel recommends that customers implement EMI heatsink ground pads on any platform under
development that will support Pentium III processors in the PGA370 socket. This recommendation
provides the ability to utilize Heatsink Grounding should it become necessary to pass EMI
emission regulations. Depending upon the platform emission characteristics, platform/processor
compatibility, platform lifetime, etc., Heatsink Grounding may not be required and, therefore,
OEMs should make the decision to implement the ground pads based upon their specific platform
design characteristics and needs. Intel will enable an EMI Heat Sink Grounding Clip solution based
upon the recommended EMI Ground pad location depicted in Figure 25.
6.2
Boxed Processor Requirements
6.2.1
Fan Heatsink Power Supply
The boxed processor's fan heatsink requires a +12 V power supply. A fan power cable is attached
to the fan and will draw power from a power header on the motherboard. The power cable
connector and pinout are shown in Figure 26. Motherboards must provide a matched power header
to support the boxed processor. Table 32 contains specifications for the input and output signals at
the fan heatsink connector. The cable length is 7.0 inches (±0.25"). The fan heatsink outputs a
SENSE signal, which is an open-collector output, that pulses at a rate of two pulses per fan
revolution. A motherboard pull-up resistor provides VOH to match the motherboard-mounted fan
speed monitor requirements, if applicable. Use of the SENSE signal is optional. If the SENSE
signal is not used, pin 3 of the connector should be tied to GND.
The power header on the baseboard must be positioned to allow the fan heatsink power cable to
reach it. The power header identification and location should be documented in the motherboard
documentation or on the motherboard. Figure 27 shows the recommended location of the fan
power connector relative to the PGA370 socket. The motherboard power header should be
positioned within 4.00 inches from the center of the PGA370 socket.
Figure 26. Boxed Processor Fan Heatsink Power Cable Connector Description
Table 32. Fan Heatsink Power and Signal Specifications
Description
Min
Typ
Max
+12 V: 12 volt fan power supply
7 V
12 V
13.8 V
IC: Fan current draw
100 mA
SENSE: SENSE frequency (motherboard should pull this
pin up to appropriate VCC with resistor)
2 pulses per
fan revolution
Pin
Signal
Straight square pin, 3-pin terminal housing with
polarizing ribs and friction locking ramp.
0.100" pin pitch, 0.025" square pin width.
Waldom/Molex P/N 22-01-3037 or equivalent.
Match with straight pin, friction lock header on motherboard
Waldom/Molex P/N 22-23-2031, AMP P/N 640456-3,
or equivalent.
1
2
3
GND
+12V
SENSE
12
3
相关PDF资料
PDF描述
RB80526RY001128 32-BIT, 1000 MHz, MICROPROCESSOR, CPGA370
RB80526RX766128 32-BIT, 766 MHz, MICROPROCESSOR, CPGA370
RC5C317B REAL TIME CLOCK, PDSO14
RC7102 133.3 MHz, PROC SPECIFIC CLOCK GENERATOR, PDSO48
RC7108 150 MHz, PROC SPECIFIC CLOCK GENERATOR, PDSO48
相关代理商/技术参数
参数描述
RB80526PZ733256 制造商:Rochester Electronics LLC 功能描述:PIII 733/133 256K ON DIE FC-PGA - Bulk
RB80526PZ733256S L4CG 制造商:Intel 功能描述:MPU Pentium 制造商:Intel 功能描述:MPU Pentium? III Processor 0.18um 733MHz 370-Pin FCPGA
RB80526PZ733256S L4ZL 制造商:Intel 功能描述:MPU Pentium 制造商:Intel 功能描述:MPU Pentium? III Processor 0.18um 733MHz 370-Pin FCPGA
RB80526PZ800256 制造商:Rochester Electronics LLC 功能描述:PIII 800/133 256K ON DIE FC-PGA - Bulk
RB80526PZ866256 制造商:Rochester Electronics LLC 功能描述:PIII 866/133 256K ON DIE FC-PGA - Bulk