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参数资料
| 型号： | RB80526PZ667256 |
| 厂商： | INTEL CORP |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 64-BIT, 667 MHz, MICROPROCESSOR, CPGA370 |
| 封装： | FCPGA-370 |
| 文件页数： | 37/74页 |
| 文件大小： | 502K |
| 代理商： | RB80526PZ667256 |
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42
Datasheet
Pentium III Processor for the PGA370 Socket up to 750 MHz
4.0
Thermal Specifications and Design Considerations
This chapter provides needed data for designing a thermal solution. However, for the correct
thermal measuring processes, refer to AP-905, Intel
Pentium III Processor Thermal Design
Guidelines (Order Number 245087). The Pentium III processor uses flip chip pin grid array
packaging technology and has a junction temperature (Tjunction) specified.
4.1
Thermal Specifications
Table 24 provides the thermal design power dissipation and maximum temperatures for the
Pentium III processor for the PGA370 socket. Systems should design for the highest possible
processor power, even if a processor with a lower thermal dissipation is planned. A thermal
solution should be designed to ensure the junction temperature never exceeds these specifications.
NOTES:
1. These values are specified at nominal VCCCORE for the processor pins.
2. Processor power includes the power dissipated by the processor core, the L2 cache, and the AGTL + bus
termination. The maximum power for each of these components does not occur simultaneously.
3. Processor core power includes only the power dissipated by the core die.
4. Tjunctionoffset is the worst-case difference between the thermal reading from the on-die thermal diode and the
hottest location on the processor’s core.
5. Tjunctionoffset values do not include any thermal diode kit measurement error. Diode kit measurement error
must be added to the Tjunctionoffset value from the table, as outlined in the Pentium
III Processor Thermal
Design Guidelines. Intel has characterized the use of the Analog Devices AD1021 diode measurement kit
and found its measurement error to be 1 °C.
6. Power density is the maximum power the processor die can dissipate (i.e., processor power) divided by the
die area over which the power is generated. Power for these processors is generated of the core area shown
in Figure 17.
Figure 17 is a block diagram of the Pentium III processor die layout. The layout differentiates the
processor core from the cache die area. In effect, the thermal design power indentified in Table 24
is dissipated entirely from the processor core area. Thermal solution designs should compensate
for this smaller heat flux area and not assume that the power is uniformly distributed across the
entire die area.
Table 24. Pentium III Processor for the PGA370 Socket Thermal Design Power 1
Processor
Core
Frequency
(MHz)
L2 Cache
Size
(Kbytes)
Processor
Power 2
(W)
Processor
Core
Power 3
(W)
Power
Density6
(W/cm2)
Maximum
TJUNCTION
(°C)
TJUNCTION
Offset 4,5
(°C)
500E
500
256
16.0
15.8
22.0
85
3.0
533EB
533
256
17.0
16.8
23.4
85
3.2
550E
550
256
17.6
17.4
24.2
85
3.3
600E
600
256
19.8
19.6
27.3
82
3.6
600EB
600
256
19.8
19.6
27.3
82
3.6
650
256
21.4
21.2
29.5
82
3.8
667B
667
256
22.0
21.8
30.3
82
4.0
700
256
23.1
22.9
31.8
80
4.1
733B
733
256
24.1
23.9
32.2
80
4.3
750
256
24.7
24.5
34.0
80
3.7
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相关代理商/技术参数 |
参数描述 |
|---|---|
| RB80526PZ733256 | 制造商:Rochester Electronics LLC 功能描述:PIII 733/133 256K ON DIE FC-PGA - Bulk |
| RB80526PZ733256S L4CG | 制造商:Intel 功能描述:MPU Pentium 制造商:Intel 功能描述:MPU Pentium? III Processor 0.18um 733MHz 370-Pin FCPGA |
| RB80526PZ733256S L4ZL | 制造商:Intel 功能描述:MPU Pentium 制造商:Intel 功能描述:MPU Pentium? III Processor 0.18um 733MHz 370-Pin FCPGA |
| RB80526PZ800256 | 制造商:Rochester Electronics LLC 功能描述:PIII 800/133 256K ON DIE FC-PGA - Bulk |
| RB80526PZ866256 | 制造商:Rochester Electronics LLC 功能描述:PIII 866/133 256K ON DIE FC-PGA - Bulk |
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