Datasheet
21
Electrical Specifications
2.10
Maximum Ratings
Table 6 lists the processor’s maximum environmental stress ratings. The processor should not
receive a clock while subjected to these conditions. Functional operating parameters are listed in
the AC and DC tables. Extended exposure to the maximum ratings may affect device reliability.
Furthermore, although the processor contains protective circuitry to resist damage from electro
static discharge (ESD), one should always take precautions to avoid high static voltages or electric
fields.
NOTES:
1. This rating applies to any processor pin.
2. Contact Intel for storage requirements in excess of one year.
2.11
Processor DC Specifications
The processor DC specifications in this section are defined at the processor core (pads) unless
noted otherwise. See Section 5 for the pin signal definitions and signal pin assignments. Most of
the signals on the processor FSB are in the AGTL+ signal group. The DC specifications for these
Previously, legacy signals and Test Access Port (TAP) signals to the processor used low-voltage
CMOS buffer types. However, these interfaces now follow DC specifications similar to GTL+. The
Table 7 through
Table list the DC specifications for the mobile Celeron processor and are valid
only while meeting specifications for junction temperature, clock frequency, and input voltages.
Unless specified otherwise, all specifications for the mobile Celeron processor are at TJ = 100 °C.
Care should be taken to read all notes associated with each parameter.
Table 6.
Processor DC Absolute Maximum Ratings
Symbol
Parameter
Min
Max
Unit
Notes
TSTORAGE
Processor storage temperature
–40
85
°C
2
VCC
Any processor supply voltage with respect to
VSS
-0.3
1.75
V
1
VinAGTL+
AGTL+ buffer DC input voltage with respect to
V
SS
-0.1
1.75
V
VinAsynch_GTL+
Asynch GTL+ buffer DC input voltage with
respect to V
SS
-0.1
1.75
V
I
VID
Max VID pin current
5
mA