参数资料
型号: RH80532NC021256
厂商: INTEL CORP
元件分类: 微控制器/微处理器
英文描述: 32-BIT, 1500 MHz, MICROPROCESSOR, CPGA478
封装: MICRO, FLIP CHIP, PGA-478
文件页数: 82/91页
文件大小: 1142K
代理商: RH80532NC021256
Datasheet
83
Thermal Specifications and Design Considerations
6
Thermal Specifications and
Design Considerations
In order to achieve proper cooling of the processor, a thermal solution (e.g., heat spreader, heat
pipe, or other heat transfer system) must make firm contact to the exposed processor die. The
processor die must be clean before the thermal solution is attached or the processor may be
damaged.
Table 36 provides the Thermal Design Power (TDP) dissipation and the minimum and maximum
TJ temperatures for the mobile Celeron processor. A thermal solution should be designed to ensure
the junction temperature remains within the minimum and maximum TJ specifications while
operating at the Thermal Design Power. Additionally, a secondary failsafe mechanism in hardware
would be provided to shutdown the processor under catastrophic thermal conditions, as described
in Section 2.4.2. TDP is a thermal design power specification based on the worst case power
dissipation of the processor while executing publicly available software under normal operating
conditions at nominal voltages. Contact your Intel Field Sales Representative for further
information.
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