84
Datasheet
Thermal Specifications and Design Considerations
NOTES:
1. TDP is defined as the worst case power dissipated by the processor while executing publicly available
software under normal operating conditions at nominal voltages that meet the load line specifications. The
TDP number shown is a specification based on ICC (maximum) at nominal voltages and indirectly tested by
this ICC (maximum) testing. TDP definition is synonymous with the Thermal Design Power (typical)
specification referred to in the previous EMTS. The Intel TDP specification is a recommended design point
and is not representative of the absolute maximum power the processor may dissipate under worst case
conditions.
2. Not 100% tested. These power specifications are determined by characterization of the processor currents at
higher temperatures and extrapolating the values for the temperature indicated.
3. The maximum junction temperature (TJ) is specified as the hottest location on the die. The thermal monitor’s
automatic mode is used to indicate that the maximum TJ has been reached. Refer to Section 6.1.1 for TJ measurement guidelines (refer to
Section 6.1.2 for thermal monitor details).
4. This product is for customers of the Embedded Intel Architecture Division.
6.1
Thermal Specifications
6.1.1
Thermal Diode
The mobile Celeron processor incorporates two methods of monitoring die temperature, the
thermal monitor and the thermal diode. The thermal monitor (detailed in
Section 6.1.2) must be
used to determine when the minimum or maximum specified processor junction temperature has
been reached. The second method, the thermal diode, can be read by an off-die analog/digital
converter (a thermal sensor) located on the motherboard, or a stand-alone measurement kit. The
thermal diode may be used to monitor the die temperature of the processor for thermal
management or instrumentation purposes but cannot be used to indicate that the maximum TJ of
the processor has been reached.
Table 37 and
Table 38 provide the diode interface and
specifications.
Note:
The reading of the thermal sensor connected to the thermal diode does not reflect the temperature
of the hottest location on the die (TJ). This is due to inaccuracies in the thermal diode, on-die
temperature gradients between the location of the thermal diode and the hottest location on the die,
Table 36. Power Specifications for the Mobile Intel Celeron Processor
Symbol
Parameter
Min
Typ
Max
Unit
Notes
TDP
Thermal Design Power at:
2.50 GHz & 1.30 V
2.40 GHz & 1.30 V
2.20 GHz & 1.30 V
2.00 GHz & 1.30 V
1.80 GHz & 1.30 V
1.70 GHz & 1.30 V
1.60 GHz & 1.30 V
1.50 GHz & 1.30 V
1.40 GHz & 1.30 V
35.0
32.0
30.0
20.8
W
At 100°C, Note 1
PAH
PSGNT
PSLP
Auto Halt/Stop Grant/Sleep
Power at:
1.30 V (for >2.0 GHz)
1.30 V (for <= 2.0 GHz)
8.0
7.5
W
At 50°C, Note 2
PDSLP
Deep Sleep Power at:
1.30 V
5.0
W
At 35°C, Note 2
TJ
Junction Temperature
0
100
°C
Note 3