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| 型号： | RH80532NC021256 |
| 厂商： | INTEL CORP |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 1500 MHz, MICROPROCESSOR, CPGA478 |
| 封装： | MICRO, FLIP CHIP, PGA-478 |
| 文件页数： | 84/91页 |
| 文件大小： | 1142K |
| 代理商： | RH80532NC021256 |
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Datasheet
85
Thermal Specifications and Design Considerations
and time based variations in the die temperature. Time based variations can occur since the
sampling rate of the sensor is much slower than the die level temperature changes.
The offset between the thermal diode based temperature reading and the hottest location of the die
(thermal monitor) may be characterized using the thermal monitor’s Automatic mode activation of
thermal control circuit. This temperature offset must be taken into account when using the
processor thermal diode to implement power management events.
NOTES:
1. Intel does not support or recommend operation of the thermal diode under reverse bias.
2. Characterized at 100°C.
3. Not 100% tested. Specified by design characterization.
4. The ideality factor, n, represents the deviation from ideal diode behavior as exemplified by the diode
equation:
IFW=Is *(e
(qVD/nkT) -1)
Where IS = saturation current, q = electronic charge, VD = voltage across the diode, k = Boltzmann Constant,
and T = absolute temperature (Kelvin).
5. The series resistance, RT, is provided to allow for a more accurate measurement of the diode junction
temperature. RT as defined includes the pins of the processor but does not include any socket resistance or
board trace resistance between the socket and the external remote diode thermal sensor. RT can be used by
remote diode thermal sensors with automatic series resistance cancellation to calibrate out this error term.
Another application is that a temperature offset can be manually calculated and programmed into an offset
register in the remote diode thermal sensors as exemplified by the equation:
Terror = [RT*(N-1)*IFWmin]/[(nk/q)*ln N]
Where Terror = sensor temperature error, N = sensor current ration, k = Boltzmann Constant, q = electronic
charge.
6.1.2
Thermal Monitor
The thermal monitor feature found in the mobile Celeron processor allows system designers to
design lower cost thermal solutions without compromising system integrity or reliability. By using
a factory-tuned, precision on-die thermal sensor, and a fast acting thermal control circuit (TCC),
the processor, without the aid of any additional software or hardware, can keep the processor’s die
temperature within factory specifications under nearly all conditions. Thus, the thermal monitor
allows the processor and system thermal solutions to be designed much closer to the power
envelopes of real applications instead of being designed to the much higher maximum processor
power envelopes.
Table 37. Thermal Diode Interface
Signal Name
Pin/Ball Number
Signal Description
THERMDA
B3
Thermal diode anode
THERMDC
C4
Thermal diode cathode
Table 38. Thermal Diode Specifications
Symbol
Parameter
Min
Typ
Max
Unit
Notes
IFW
Forward Bias Current
5
300
A
1
n
Diode Ideality Factor
1.0012
1.0021
1.0030
2, 3, 4
RT
Series Resistance
3.86
ohms
2, 3, 5
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相关代理商/技术参数 |
参数描述 |
|---|---|
| RH80532NC025256 | 制造商:未知厂家 制造商全称:未知厂家 功能描述:Microprocessor |
| RH80532NC029256 | 制造商:未知厂家 制造商全称:未知厂家 功能描述:Microprocessor |
| RH80532NC033256 | 制造商:未知厂家 制造商全称:未知厂家 功能描述:Microprocessor |
| RH80532NC049256 | 制造商:Rochester Electronics LLC 功能描述:- Bulk |
| RH80532NC049256S L8SB | 制造商:Intel 功能描述:INTEL CELERON PROCESSOR AVAILABLE AT 1.60 GHZ, 1.8 GHZ, 2.00 GHZ, 2.2 GHZ |
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