Datasheet
91
Debug Tools Specifications
8
Debug Tools Specifications
Please refer to the Mobile Intel Pentium 4 Processor-M and Intel 845MP/845MZ Chipset
Platform Design Guide for information regarding debug tools specifications.
8.1
Logic Analyzer Interface (LAI)
Intel is working with two logic analyzer vendors to provide logic analyzer interfaces (LAIs) for use
in debugging mobile Celeron processor systems. Tektronix and Agilent should be contacted to get
specific information about their logic analyzer interfaces. The following information is general in
nature. Specific information must be obtained from the logic analyzer vendor.
Due to the complexity of mobile Celeron processor systems, the LAI is critical in providing the
ability to probe and capture FSB signals. There are two sets of considerations to keep in mind when
designing a mobile Celeron processor system that can make use of an LAI: mechanical and
electrical.
8.1.1
Mechanical Considerations
The LAI is installed between the processor socket and the mobile Celeron processor. The LAI pins
plug into the socket, while the mobile Celeron processor pins plug into a socket on the LAI.
Cabling that is part of the LAI egresses the system to allow an electrical connection between the
mobile Celeron processor and a logic analyzer. The maximum volume occupied by the LAI, known
as the keepout volume, as well as the cable egress restrictions, should be obtained from the logic
analyzer vendor. System designers must make sure that the keepout volume remains unobstructed
inside the system.
8.1.2
Electrical Considerations
The LAI will also affect the electrical performance of the FSB; therefore, it is critical to obtain
electrical load models from each of the logic analyzer vendors to be able to run system level
simulations to prove that their tool will work in the system. Contact the logic analyzer vendor for
electrical specifications and load models for the LAI solution they provide.
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