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参数资料
型号： RH80532NC021256
厂商： INTEL CORP
元件分类： 微控制器/微处理器
英文描述： 32-BIT, 1500 MHz, MICROPROCESSOR, CPGA478
封装： MICRO, FLIP CHIP, PGA-478
文件页数： 23/91页
文件大小： 1142K
代理商： RH80532NC021256
Datasheet
Contents
1
Introduction ...................................................................................................................................... 9
1.1
Terminology ........................................................................................................................ 10
1.2
References ......................................................................................................................... 10
2
Electrical Specifications ................................................................................................................. 11
2.1
FSB and GTLREF...............................................................................................................11
2.2
Power and Ground Pins...................................................................................................... 11
2.3
Decoupling Guidelines ........................................................................................................11
2.3.1
VCC Decoupling .................................................................................................... 12
2.3.2
FSB AGTL+ Decoupling ........................................................................................ 12
2.3.3
FSB Clock (BCLK[1:0]) and Processor Clocking ................................................... 12
2.4
Voltage Identification and Power Sequencing .................................................................... 13
2.4.1
Phase Lock Loop (PLL) Power and Filter .............................................................. 14
2.4.2
Catastrophic Thermal Protection ........................................................................... 16
2.5
Signal Terminations, Unused Pins and TESTHI[11:0] ........................................................ 16
2.6
FSB Signal Groups ............................................................................................................. 18
2.7
Asynchronous GTL+ Signals .............................................................................................. 20
2.8
Test Access Port (TAP) Connection ................................................................................... 20
2.9
FSB Frequency Select Signals (BSEL[1:0]) ....................................................................... 20
2.10
Maximum Ratings ............................................................................................................... 21
2.11
Processor DC Specifications .............................................................................................. 21
2.12
AGTL+ FSB Specifications ................................................................................................. 29
2.13
FSB AC Specifications........................................................................................................ 30
2.14
Processor AC Timing Waveforms....................................................................................... 35
3
FSB Signal Quality Specifications ................................................................................................. 45
3.1
FSB Clock (BCLK) Signal Quality Specifications and Measurement Guidelines................ 45
3.2
FSB Signal Quality Specifications and Measurement Guidelines ...................................... 46
3.3
FSB Signal Quality Specifications and Measurement Guidelines ...................................... 49
3.3.1
Overshoot/Undershoot Guidelines......................................................................... 49
3.3.2
Overshoot/Undershoot Magnitude ......................................................................... 49
3.3.3
Overshoot/Undershoot Pulse Duration .................................................................. 49
3.3.4
Activity Factor ........................................................................................................ 50
3.3.5
Reading Overshoot/Undershoot Specification Tables ........................................... 50
3.3.6
Conformance Determination to Overshoot/Undershoot Specifications.................. 51
4
Package Mechanical Specifications ..............................................................................................55
4.1
Processor Pinout ................................................................................................................ 59
5
Pin Listing and Signal Definitions .................................................................................................. 61
5.1
Mobile Intel Celeron Processor Pin Assignments........................................................... 61
5.2
Alphabetical Signals Reference .......................................................................................... 75
6
Thermal Specifications and Design Considerations ...................................................................... 83
6.1
Thermal Specifications .......................................................................................................84
6.1.1
Thermal Diode ....................................................................................................... 84
6.1.2
Thermal Monitor..................................................................................................... 85
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