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参数资料
| 型号： | S29CD032G0RFFN003 |
| 厂商： | SPANSION LLC |
| 元件分类： | PROM |
| 英文描述： | 1M X 32 FLASH 2.7V PROM, 48 ns, PBGA80 |
| 封装： | 13 X 11 MM, 1 MM PITCH, LEAD FREE, FORTIFIED, BGA-80 |
| 文件页数： | 3/81页 |
| 文件大小： | 1276K |
| 代理商： | S29CD032G0RFFN003 |
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March 3, 2009 S29CD-G_00_B1
S29CD-G Flash Family
9
Da ta
Shee t
(Prelim i nar y )
2.
Ordering Information
The order number (Valid Combination) is formed by the following:
Valid Combinations
Valid Combinations list configurations planned to be supported in volume for this device. Consult your local
sales office to confirm availability of specific valid combinations and to check on newly released
combinations.
Notes
1. The ordering part number that appears on BGA packages omits the leading “S29”.
2. Contact your local sales representative for GT grade options.
3. Refer to the KGD data sheet supplement for die/wafer sales.
S29CD032G
0J
F
A
I
0
Packing Type
0
= Tray
2
= 7” Tape and Reel
3
= 13” Tape and Reel
Additional Ordering Options (16th Character) Top or Bottom Boot
0
= Top Boot
1
= Bottom Boot
Additional Ordering Options (15th Character) Mask Revision
0
= A
1
= A1 (16 Mb only) with 7E, 36, 01/00 Autoselect ID
2
= A1 (16 Mb only) with 7E, 08, 01/00 Autoselect ID
Temperature Range and Quality Grade
A = Industrial (–40°C to +85°C), GT grade
I
= Industrial (–40°C to +85°C)
M = Extended (–40°C to +125°C), GT grade
N = Extended (–40°C to +125°C)
Material Set
A = Standard
F
= Pb-free Option
Package Type
Q = Plastic Quad Flat Package (PQFP)
F
= Fortified Ball Grid Array, 1.0 mm pitch package
Clock Frequency
0J = 40 MHz
0M = 56 MHz
0P = 66 MHz
0R = 75 MHz (32 Mb Only)
Device Number/description
S29CD032G/S29CD016G
32 or 16 Megabit (1 M or 512 K x 32-Bit) CMOS 2.5 Volt-only Burst Mode,
Dual Boot, Simultaneous Read/Write Flash Memory
Manufactured on 110 nm floating gate technology
Valid Combinations
S29CD032G
S29CD016G
0R (32 MB Only), 0P, 0M, 0J
QAI, QFI,
QAN, QFN
00, 01
FAI, FFI, FAN, FFN
相关PDF资料 |
PDF描述 |
|---|---|
| S29CD032G0RQFI012 | 1M X 32 FLASH 2.7V PROM, 48 ns, PQFP80 |
| S29CL032J0JFAM020 | 1M X 32 FLASH 3.3V PROM, 54 ns, PBGA80 |
| S29CL032J0JFFM020 | 1M X 32 FLASH 3.3V PROM, 54 ns, PBGA80 |
| S29CL032J0RFAM012 | 1M X 32 FLASH 3.3V PROM, 48 ns, PBGA80 |
| S29GL032A10TAIR11 | Ceramic Chip Capacitors / High Voltage; Capacitance [nom]: 3.3pF; Working Voltage (Vdc)[max]: 500V; Capacitance Tolerance: +/-10%; Dielectric: Multilayer Ceramic; Temperature Coefficient: C0G (NP0); Lead Style: Surface Mount Chip; Lead Dimensions: 0805; Termination: Solder (SnPb) Plated Nickel Barrier; Body Dimensions: 0.079" x 0.049"; Container: Bulk; Features: High Voltage; Unmarked |
相关代理商/技术参数 |
参数描述 |
|---|---|
| S29CD032J0MQAN010 | 制造商:Spansion 功能描述: |
| S29CD032J0MQFM010U | 制造商:Spansion 功能描述:N/A - Trays |
| S29CD032J0PFAM010 | 制造商:Spansion 功能描述: |
| S29CD032J0PQFI010 | 制造商:Spansion 功能描述:AUTO 3.3V 512KX32 FLASH - Trays |
| S29CL016J0JQFM030 | 制造商:Spansion 功能描述:FLASH PARALLEL 3.3V 16MBIT 512KX32 54NS 80PQFP - Trays |
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