参数资料
型号: S29CD032G0RFFN003
厂商: SPANSION LLC
元件分类: PROM
英文描述: 1M X 32 FLASH 2.7V PROM, 48 ns, PBGA80
封装: 13 X 11 MM, 1 MM PITCH, LEAD FREE, FORTIFIED, BGA-80
文件页数: 7/81页
文件大小: 1276K
代理商: S29CD032G0RFFN003
March 3, 2009 S29CD-G_00_B1
S29CD-G Flash Family
13
Da ta
Shee t
(Prelim i nar y )
6.
Physical Dimensions - PRQ080–80-Lead Plastic Quad Flat Package
3213\38.4C
PACKAGE
PQR 080
JEDEC
MO-108(B)CB-1
NOTES
SYMBOL
MIN
NOM
MAX
A
--
3.35
A1
0.25
--
A2
2.70
2.80
2.90
b
0.30
--
0.45
SEE NOTE 4
c
0.15
--
0.23
D
17.00
17.20
17.40
D1
13.90
14.00
14.10
SEE NOTE 3
D3
--
12.0
--
REFERENCE
e
--
0.80
--
BASIC, SEE NOTE 7
E
23.00
23.20
23.40
E1
19.90
20.00
20.10
SEE NOTE 3
E3
--
18.40
--
REFERENCE
aaa
---
0.20
---
ccc
0.10
L
0.73
0.88
1.03
P24
Q40
R64
S80
NOTES:
1.
ALL DIMENSIONS AND TOLERANCES CONFORM TO
ANSI Y14.5M-1982.
2.
DATUM PLANE -A- IS LOCATED AT THE MOLD PARTING LINE
AND IS COINCIDENT WITH THE BOTTOM OF THE LEAD WHERE
THE LEAD EXITS THE PLASTIC BODY.
3.
DIMENSIONS "D1" AND "E1" DO NOT INCLUD MOLD PROTRUSION.
ALLOWABLE PROTRUSION IS 0.25 mm PER SIDE.
DIMENSIONS "D1" AND "E1" INCLUDE MOLD MISMATCH AND
ARE DETERMINED AT DATUM PLANE -A-
4.
DIMENSION "B" DOES NOT INCLUDE DAMBAR PROTRUSION.
5.
CONTROLLING DIMENSIONS: MILLIMETER.
6.
DIMENSIONS "D" AND "E" ARE MEASURED FROM BOTH
INNERMOST AND OUTERMOST POINTS.
7.
DEVIATION FROM LEAD-TIP TRUE POSITION SHALL BE WITHIN
±0.0076 mm FOR PITCH > 0.5 mm AND WITHIN ±0.04 FOR
PITCH < 0.5 mm.
8.
LEAD COPLANARITY SHALL BE WITHIN: (REFER TO 06-500)
1 - 0.10 mm FOR DEVICES WITH LEAD PITCH OF 0.65 - 0.80 mm
2 - 0.076 mm FOR DEVICES WITH LEAD PITCH OF 0.50 mm.
COPLANARITY IS MEASURED PER SPECIFICATION 06-500.
9.
HALF SPAN (CENTER OF PACKAGE TO LEAD TIP) SHALL BE
WITHIN ±0.0085".
b
c
SECTION S-S
6
3
6
-B-
PIN R
PIN S
-A-
PIN ONE I.D.
D1
D
D3
PIN Q
-D-
PIN P
E
E1
E3
SEE NOTE 3
A
A1
A2
-C-
-A-
SEATING PLANE
2
e BASIC
SEE DETAIL X
S
DETAIL X
0.25
A
C
ccc
SD S
4
C AB
M
a
b
0-7
a
0MIN.
L
GAGE
PLANE
7
TYP.
0.30 ± 0.05 R
7
TYP.
0.20 MIN. FLAT SHOULDER
相关PDF资料
PDF描述
S29CD032G0RQFI012 1M X 32 FLASH 2.7V PROM, 48 ns, PQFP80
S29CL032J0JFAM020 1M X 32 FLASH 3.3V PROM, 54 ns, PBGA80
S29CL032J0JFFM020 1M X 32 FLASH 3.3V PROM, 54 ns, PBGA80
S29CL032J0RFAM012 1M X 32 FLASH 3.3V PROM, 48 ns, PBGA80
S29GL032A10TAIR11 Ceramic Chip Capacitors / High Voltage; Capacitance [nom]: 3.3pF; Working Voltage (Vdc)[max]: 500V; Capacitance Tolerance: +/-10%; Dielectric: Multilayer Ceramic; Temperature Coefficient: C0G (NP0); Lead Style: Surface Mount Chip; Lead Dimensions: 0805; Termination: Solder (SnPb) Plated Nickel Barrier; Body Dimensions: 0.079&quot; x 0.049&quot;; Container: Bulk; Features: High Voltage; Unmarked
相关代理商/技术参数
参数描述
S29CD032J0MQAN010 制造商:Spansion 功能描述:
S29CD032J0MQFM010U 制造商:Spansion 功能描述:N/A - Trays
S29CD032J0PFAM010 制造商:Spansion 功能描述:
S29CD032J0PQFI010 制造商:Spansion 功能描述:AUTO 3.3V 512KX32 FLASH - Trays
S29CL016J0JQFM030 制造商:Spansion 功能描述:FLASH PARALLEL 3.3V 16MBIT 512KX32 54NS 80PQFP - Trays