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参数资料
| 型号： | S29CD032G0RFFN003 |
| 厂商： | SPANSION LLC |
| 元件分类： | PROM |
| 英文描述： | 1M X 32 FLASH 2.7V PROM, 48 ns, PBGA80 |
| 封装： | 13 X 11 MM, 1 MM PITCH, LEAD FREE, FORTIFIED, BGA-80 |
| 文件页数： | 75/81页 |
| 文件大小： | 1276K |
| 代理商： | S29CD032G0RFFN003 |
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March 3, 2009 S29CD-G_00_B1
S29CD-G Flash Family
75
Da ta
Shee t
(Prelim i nar y )
Initial Burst Access Delay Control
Figure 3 - Valid Address line changed.
Notes - Clock cycles updated.
Configuration Register
Table 9: CR14 reserve bit assigned ASD.
Table 9: Speed options changed.
Table 10: CR14 reserve changed to ASD.
Table12. Sector Addresses for Ordering Option 00
Bank changed to 0.
Bank changed to 1.
Table 13. Sector Addresses for Ordering Option 01
Bank changed to 0.
Bank changed to 1.
Table 16. Device Geometry Definition
0005 = supports x16 and x32 via WORD#...” Removed.
Unlock Bypass Command Sequence
Table “18” replaced with “19” in text.
Table 19. Memory Array Command Definitions (x32 Mode)
Autoselect (7) - Device ID (11); Fifth/Data changed to “36”.
Table 20. Sector Protection Command Definitions (x32 Mode)
PBB Status (11,12) Third/Addr changed to “SG”. PPB Lock Bit Status; Third/Addr “BA” removed. DYB Status;
Third/Addr changed to “SA”.
Absolute Maximum Ratings
Address, Data... changed to 3.6v.
Table 22 CMOS Compatible
Input High Voltage Max changed to 3.6. RY/BY#, OUtput Low Current Min removed, Max added (8).
Table 23. Test Specifications
Test conditions changed to OJ,OM,OP.
AC Characteristics
Figure 14 updated RESET#.
Table number 24. Asynchronous Read Operations
OM speed options; Output Enable to Output Delay “20” added.
Table 26. Hardware Reset
Last row deleted.
Erase/Program Operations
TWADVH row added. TWCKS row added.
Table 27. Alternate CE# Controlled Erase/Program Operations
TWPH row added, TWADVH row added, TWCKS row added.
Physical Dimensions
Latchup characteristics deleted.
Pin Description
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PDF描述 |
|---|---|
| S29CD032G0RQFI012 | 1M X 32 FLASH 2.7V PROM, 48 ns, PQFP80 |
| S29CL032J0JFAM020 | 1M X 32 FLASH 3.3V PROM, 54 ns, PBGA80 |
| S29CL032J0JFFM020 | 1M X 32 FLASH 3.3V PROM, 54 ns, PBGA80 |
| S29CL032J0RFAM012 | 1M X 32 FLASH 3.3V PROM, 48 ns, PBGA80 |
| S29GL032A10TAIR11 | Ceramic Chip Capacitors / High Voltage; Capacitance [nom]: 3.3pF; Working Voltage (Vdc)[max]: 500V; Capacitance Tolerance: +/-10%; Dielectric: Multilayer Ceramic; Temperature Coefficient: C0G (NP0); Lead Style: Surface Mount Chip; Lead Dimensions: 0805; Termination: Solder (SnPb) Plated Nickel Barrier; Body Dimensions: 0.079" x 0.049"; Container: Bulk; Features: High Voltage; Unmarked |
相关代理商/技术参数 |
参数描述 |
|---|---|
| S29CD032J0MQAN010 | 制造商:Spansion 功能描述: |
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| S29CD032J0PFAM010 | 制造商:Spansion 功能描述: |
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