参数资料
型号: S29CD032G0RFFN003
厂商: SPANSION LLC
元件分类: PROM
英文描述: 1M X 32 FLASH 2.7V PROM, 48 ns, PBGA80
封装: 13 X 11 MM, 1 MM PITCH, LEAD FREE, FORTIFIED, BGA-80
文件页数: 45/81页
文件大小: 1276K
代理商: S29CD032G0RFFN003
March 3, 2009 S29CD-G_00_B1
S29CD-G Flash Family
3
Da ta
Shee t
(Prelim i nar y )
The device offers two power-saving features. When addresses are stable for a specified amount of time, the
device enters the automatic sleep mode. The system can also place the device into the standby mode.
Power consumption is greatly reduced in both these modes.
AMD’s Flash technology combines years of Flash memory manufacturing experience to produce the highest
levels of quality, reliability and cost effectiveness. The device electrically erases all bits within a sector
simultaneously via Fowler-Nordheim tunnelling. The data is programmed using hot electron injection.
相关PDF资料
PDF描述
S29CD032G0RQFI012 1M X 32 FLASH 2.7V PROM, 48 ns, PQFP80
S29CL032J0JFAM020 1M X 32 FLASH 3.3V PROM, 54 ns, PBGA80
S29CL032J0JFFM020 1M X 32 FLASH 3.3V PROM, 54 ns, PBGA80
S29CL032J0RFAM012 1M X 32 FLASH 3.3V PROM, 48 ns, PBGA80
S29GL032A10TAIR11 Ceramic Chip Capacitors / High Voltage; Capacitance [nom]: 3.3pF; Working Voltage (Vdc)[max]: 500V; Capacitance Tolerance: +/-10%; Dielectric: Multilayer Ceramic; Temperature Coefficient: C0G (NP0); Lead Style: Surface Mount Chip; Lead Dimensions: 0805; Termination: Solder (SnPb) Plated Nickel Barrier; Body Dimensions: 0.079" x 0.049"; Container: Bulk; Features: High Voltage; Unmarked
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参数描述
S29CD032J0MQAN010 制造商:Spansion 功能描述:
S29CD032J0MQFM010U 制造商:Spansion 功能描述:N/A - Trays
S29CD032J0PFAM010 制造商:Spansion 功能描述:
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