参数资料
型号: S29CD032G0RFFN003
厂商: SPANSION LLC
元件分类: PROM
英文描述: 1M X 32 FLASH 2.7V PROM, 48 ns, PBGA80
封装: 13 X 11 MM, 1 MM PITCH, LEAD FREE, FORTIFIED, BGA-80
文件页数: 77/81页
文件大小: 1276K
代理商: S29CD032G0RFFN003
March 3, 2009 S29CD-G_00_B1
S29CD-G Flash Family
77
Da ta
Shee t
(Prelim i nar y )
28.2
Family Data Sheet Revision History
28.2.1
Revision A (July 18, 2005)
Global
Merged S29CD016G and S29CD032G data sheets into one family CD-G data sheet
Changed data sheet status to “Preliminary Information”
Added in 75MHz parameters
Ordering Information
Model numbers (character 15th & 16th) changed to reflect mask revision, autoselect code and top/bottom
boot
Added GT Grade under Temperature Range and Quality Grade
Added note to “Refer to the KGD Data Sheet supplement for die/wafer sales”
Product Selector Guide
Changed Min. Initial clock Delay values
Memory Map and Sector Protect Groups
Modified Notes 1 & 3
Add in Note 4
Simultaneous Read/Write Operation
Removed Table 2: Bank Assignment for Boot Bank Sector Device
Removed Table 3: Ordering Option 00
Removed Table 4: Ordering Option 01
Secured Silicon Sector
Added in Electronic Marking
Common Flash Memory Interface
Updated web site to reflect Spansion.com
Changed address 28h from 0003h to 0005h
Command Definitions
Remove Secured Silicon Protection Bit Program command
Absolute Maximum Ratings
Changed Overshoot/Undershoot to be ± 0.7V from ± 2.0V
Changed Address, Data, Control Signals to -0.5V to 3V for 16Mb
Operating Ranges
Changed VIO to 1.65V to 3.6V
Burst Mode Read for 32Mb & 16 Mb
Changed tADVCS = 5.75ns for 75MHz
Changed tADVCH to be 2ns for 66MHz, 56MHz, 40 MHz
Changed tIACC values
Rounded tCLK values
Changed tCR to tCLKR
Changed tCF to tCLKF
Changed tCL to tCLKL
相关PDF资料
PDF描述
S29CD032G0RQFI012 1M X 32 FLASH 2.7V PROM, 48 ns, PQFP80
S29CL032J0JFAM020 1M X 32 FLASH 3.3V PROM, 54 ns, PBGA80
S29CL032J0JFFM020 1M X 32 FLASH 3.3V PROM, 54 ns, PBGA80
S29CL032J0RFAM012 1M X 32 FLASH 3.3V PROM, 48 ns, PBGA80
S29GL032A10TAIR11 Ceramic Chip Capacitors / High Voltage; Capacitance [nom]: 3.3pF; Working Voltage (Vdc)[max]: 500V; Capacitance Tolerance: +/-10%; Dielectric: Multilayer Ceramic; Temperature Coefficient: C0G (NP0); Lead Style: Surface Mount Chip; Lead Dimensions: 0805; Termination: Solder (SnPb) Plated Nickel Barrier; Body Dimensions: 0.079" x 0.049"; Container: Bulk; Features: High Voltage; Unmarked
相关代理商/技术参数
参数描述
S29CD032J0MQAN010 制造商:Spansion 功能描述:
S29CD032J0MQFM010U 制造商:Spansion 功能描述:N/A - Trays
S29CD032J0PFAM010 制造商:Spansion 功能描述:
S29CD032J0PQFI010 制造商:Spansion 功能描述:AUTO 3.3V 512KX32 FLASH - Trays
S29CL016J0JQFM030 制造商:Spansion 功能描述:FLASH PARALLEL 3.3V 16MBIT 512KX32 54NS 80PQFP - Trays