参数资料
型号: S29CD032G0RFFN003
厂商: SPANSION LLC
元件分类: PROM
英文描述: 1M X 32 FLASH 2.7V PROM, 48 ns, PBGA80
封装: 13 X 11 MM, 1 MM PITCH, LEAD FREE, FORTIFIED, BGA-80
文件页数: 5/81页
文件大小: 1276K
代理商: S29CD032G0RFFN003
March 3, 2009 S29CD-G_00_B1
S29CD-G Flash Family
11
Da ta
Shee t
(Prelim i nar y )
4.
Block Diagram of Simultaneous Read/Write Circuit
Note
Address bus is A19–A0 for 32 Mb device, A18–A0 for 16 Mb device. Data bus is D31–DQ0.
VCC
VSS
Upper Bank Address
RESET#
WE#
CE#
ADV#
STATE
CONTROL
&
COMMAND
REGISTER
Upper Bank
X-Decoder
Y-Decoder
Latches
and
Control
Logic
OE#
DQmax–DQ0
Lower Bank
Y-Decoder
X-Decoder
Latches
and
Control
Logic
Lower Bank Address
Status
Control
Amax–A0
A
max
–A0
A
max
–A0
Amax–A0
DQ
max
–DQ0
DQ
max
–DQ0
相关PDF资料
PDF描述
S29CD032G0RQFI012 1M X 32 FLASH 2.7V PROM, 48 ns, PQFP80
S29CL032J0JFAM020 1M X 32 FLASH 3.3V PROM, 54 ns, PBGA80
S29CL032J0JFFM020 1M X 32 FLASH 3.3V PROM, 54 ns, PBGA80
S29CL032J0RFAM012 1M X 32 FLASH 3.3V PROM, 48 ns, PBGA80
S29GL032A10TAIR11 Ceramic Chip Capacitors / High Voltage; Capacitance [nom]: 3.3pF; Working Voltage (Vdc)[max]: 500V; Capacitance Tolerance: +/-10%; Dielectric: Multilayer Ceramic; Temperature Coefficient: C0G (NP0); Lead Style: Surface Mount Chip; Lead Dimensions: 0805; Termination: Solder (SnPb) Plated Nickel Barrier; Body Dimensions: 0.079" x 0.049"; Container: Bulk; Features: High Voltage; Unmarked
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