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参数资料
| 型号： | S29CD032G0RFFN003 |
| 厂商： | SPANSION LLC |
| 元件分类： | PROM |
| 英文描述： | 1M X 32 FLASH 2.7V PROM, 48 ns, PBGA80 |
| 封装： | 13 X 11 MM, 1 MM PITCH, LEAD FREE, FORTIFIED, BGA-80 |
| 文件页数： | 74/81页 |
| 文件大小： | 1276K |
| 代理商： | S29CD032G0RFFN003 |
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74
S29CD-G Flash Family
S29CD-G_00_B1 March 3, 2009
Data
Sheet
(Pre limin ar y)
28. Revision Summary
28.1
S29CD016G Revision History
28.1.1
Revision A1 (March 22, 2004)
Performance Characteristics
Burst Mode Read: changed to 66-MHz.
Ordering Information
Changed device number/description call out to show the two 16-Mbit configurations.
Table 12 and Table 13
Corrected which sectors report to which bank.
Asynchronous Read Operations Table
Removed the OR Speed option.
28.1.2
Revision A2 (May 24, 2004)
“Spansion” logo
Replaces AMD in bullet seven, first column.
Fujitsu MBM29LV and MBM129F
Added to bullet ten, first column.
Ultra Low Power Consumption Bullet
“capable of...” deleted from first bullet, second column.
Block diagram
Reset# moved, RY/BY added.
Simultaneous Read/Write Circuit Block Diagram
RY/BY added; Bank 1 added; Bank 0 added.
Pin Configuration
“A pull-up resistor of 10k...” added to RY/BY#.
Ordering Information
Additional ordering options updated to “protects sectors 44 and 45”.
Device Number/Description
Bit description altered.
Simultaneous Read/Write Operation With Zero Latency
Table 3 and 4 Bank # change.
Auto Select Mode
Table 5: Manufacturer ID Row updated (A3, A2).
Table 5: DQ7 to DQ0 Column updated.
Linear Burst Read Operations
Table 6: “(x16)” removed from header row.
IND/Wait# Operation in Linear Mode
Figure 2 - “Address 2” removed.
相关PDF资料 |
PDF描述 |
|---|---|
| S29CD032G0RQFI012 | 1M X 32 FLASH 2.7V PROM, 48 ns, PQFP80 |
| S29CL032J0JFAM020 | 1M X 32 FLASH 3.3V PROM, 54 ns, PBGA80 |
| S29CL032J0JFFM020 | 1M X 32 FLASH 3.3V PROM, 54 ns, PBGA80 |
| S29CL032J0RFAM012 | 1M X 32 FLASH 3.3V PROM, 48 ns, PBGA80 |
| S29GL032A10TAIR11 | Ceramic Chip Capacitors / High Voltage; Capacitance [nom]: 3.3pF; Working Voltage (Vdc)[max]: 500V; Capacitance Tolerance: +/-10%; Dielectric: Multilayer Ceramic; Temperature Coefficient: C0G (NP0); Lead Style: Surface Mount Chip; Lead Dimensions: 0805; Termination: Solder (SnPb) Plated Nickel Barrier; Body Dimensions: 0.079" x 0.049"; Container: Bulk; Features: High Voltage; Unmarked |
相关代理商/技术参数 |
参数描述 |
|---|---|
| S29CD032J0MQAN010 | 制造商:Spansion 功能描述: |
| S29CD032J0MQFM010U | 制造商:Spansion 功能描述:N/A - Trays |
| S29CD032J0PFAM010 | 制造商:Spansion 功能描述: |
| S29CD032J0PQFI010 | 制造商:Spansion 功能描述:AUTO 3.3V 512KX32 FLASH - Trays |
| S29CL016J0JQFM030 | 制造商:Spansion 功能描述:FLASH PARALLEL 3.3V 16MBIT 512KX32 54NS 80PQFP - Trays |
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