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参数资料
| 型号： | S71JL064H80BFI122 |
| 厂商： | ADVANCED MICRO DEVICES INC |
| 元件分类： | 存储器 |
| 英文描述： | SPECIALTY MEMORY CIRCUIT, PBGA73 |
| 封装： | 11.60 X 8 MM, FBGA-73 |
| 文件页数： | 30/95页 |
| 文件大小： | 2244K |
| 代理商： | S71JL064H80BFI122 |
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36
S71JLxxxHxx_00A1 February 25, 2004
Pr el i m i n ary
FTA088
3237 \ 16-038.14b
PACKAGE
FTA 088
JEDEC
N/A
11.60 mm x 8.00 mm
PACKAGE
SYMBOL
MIN
NOM
MAX
NOTE
A
---
1.40
PROFILE
A1
0.25
---
BALL HEIGHT
A2
1.00
---
1.11
BODY THICKNESS
D
11.60 BSC.
BODY SIZE
E
8.00 BSC.
BODY SIZE
D1
8.80 BSC.
MATRIX FOOTPRINT
E1
7.20 BSC.
MATRIX FOOTPRINT
MD
12
MATRIX SIZE D DIRECTION
ME
10
MATRIX SIZE E DIRECTION
n
88
BALL COUNT
φb
0.30
0.35
0.40
BALL DIAMETER
eE
0.80 BSC.
BALL PITCH
eD
0.80 BSC
BALL PITCH
SD / SE
0.40 BSC.
SOLDER BALL PLACEMENT
A3,A4,A5,A6,A7,A8,B1,B10,C1,C10,D1,D10
DEPOPULATED SOLDER BALLS
E1,E10,F1,F10,G1,G10,H1,H10
J1,J10,K1,K10,L1,L10,M3,M4,M5,M6,M7,M8
NOTES:
1.
DIMENSIONING AND TOLERANCING METHODS PER
ASME Y14.5M-1994.
2.
ALL DIMENSIONS ARE IN MILLIMETERS.
3.
BALL POSITION DESIGNATION PER JESD 95-1, SPP-010.
4.
e REPRESENTS THE SOLDER BALL GRID PITCH.
5.
SYMBOL "MD" IS THE BALL MATRIX SIZE IN THE "D"
DIRECTION.
SYMBOL "ME" IS THE BALL MATRIX SIZE IN THE
"E" DIRECTION.
n IS THE NUMBER OF POPULTED SOLDER BALL POSITIONS
FOR MATRIX SIZE MD X ME.
6
DIMENSION "b" IS MEASURED AT THE MAXIMUM BALL
DIAMETER IN A PLANE PARALLEL TO DATUM C.
7
SD AND SE ARE MEASURED WITH RESPECT TO DATUMS A
AND B AND DEFINE THE POSITION OF THE CENTER SOLDER
BALL IN THE OUTER ROW.
WHEN THERE IS AN ODD NUMBER OF SOLDER BALLS IN THE
OUTER ROW SD OR SE = 0.000.
WHEN THERE IS AN EVEN NUMBER OF SOLDER BALLS IN THE
OUTER ROW, SD OR SE = e/2
8.
"+" INDICATES THE THEORETICAL CENTER OF DEPOPULATED
BALLS.
9.
N/A
10 A1 CORNER TO BE IDENTIFIED BY CHAMFER, LASER OR INK
MARK, METALLIZED MARK INDENTATION OR OTHER MEANS.
10
INDEX MARK
L
M
88X
eD
CORNER
C
0.15
(2X)
C
0.15
E1
7
SE
B
A
D1
A
B
DC
E
F
HG
10
8
9
7
5
6
4
2
3
J
K
1
eE
SD
BOTTOM VIEW
6
b
0.20 C
C
0.15
0.08
MC
AB
PIN A1
7
D
E
PIN A1
C
TOP VIEW
SIDE VIEW
CORNER
A2
A1
A
0.08
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