型号: | S71JL064H80BFI122 |
厂商: | ADVANCED MICRO DEVICES INC |
元件分类: | 存储器 |
英文描述: | SPECIALTY MEMORY CIRCUIT, PBGA73 |
封装: | 11.60 X 8 MM, FBGA-73 |
文件页数: | 86/95页 |
文件大小: | 2244K |
代理商: | S71JL064H80BFI122 |
相关PDF资料 |
PDF描述 |
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S71JL064H80BAI020 | SPECIALTY MEMORY CIRCUIT, PBGA73 |
S71WS512NC0BAWEK2 | Stacked Multi-Chip Product (MCP) |
S71WS512NC0BAWEK3 | Stacked Multi-Chip Product (MCP) |
S71WS512NC0BAWEN0 | Stacked Multi-Chip Product (MCP) |
S71WS512NC0BAWEN2 | Stacked Multi-Chip Product (MCP) |
相关代理商/技术参数 |
参数描述 |
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S71KL512SC0BHV000 | 功能描述:IC 512MB FLASH 64MB DRAM 24FBGA 制造商:cypress semiconductor corp 系列:HyperFlash? + HyperRAM? KL 包装:托盘 零件状态:在售 格式 - 存储器:多芯(FLASH/RAM) 存储器类型:FLASH + DRAM 存储容量:512Mbit Flash, 64Mbit RAM 速度:100MHz 接口:并联,串行 电压 - 电源:2.7 V ~ 3.6 V 工作温度:-40°C ~ 105°C(TA) 封装/外壳:24-VBGA 供应商器件封装:24-FBGA(6x8) 标准包装:338 |
S71NS032J80 | 制造商:SPANSION 制造商全称:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
S71NS032J80BJWRA | 制造商:SPANSION 制造商全称:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
S71NS032JA0 | 制造商:SPANSION 制造商全称:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |
S71NS032JA0BJWRT | 制造商:SPANSION 制造商全称:SPANSION 功能描述:Stacked Multi-Chip Product (MCP) |