参数资料
型号: RK80546KG0802MM
厂商: INTEL CORP
元件分类: 微控制器/微处理器
英文描述: 64-BIT, 3000 MHz, MICROPROCESSOR, CPGA604
封装: FLIP CHIP, MICRO PGA-604
文件页数: 12/106页
文件大小: 4724K
代理商: RK80546KG0802MM
Datasheet
13
Introduction
the name does not imply an active state but describes part of a binary sequence (such as address or
data), the ‘#’ symbol implies that the signal is inverted. For example, D[3:0] = ‘HLHL’ refers to a
hex ‘A’, and D[3:0]# = ‘LHLH’ also refers to a hex ‘A’ (H= High logic level, L= Low logic level).
“Front side bus” or “System bus” refers to the interface between the processor, system core logic
(a.k.a. the chipset components), and other bus agents. The system bus is a multiprocessing interface
to processors, memory, and I/O. For this document, “front side bus” or “system bus” are used as
generic terms for the “64-bit Intel Xeon processor with 2 MB L2 cache system bus”.
Commonly used terms are explained here for clarification:
64-bit Intel Xeon processor with 2 MB L2 cache — Intel 64-bit microprocessor intended for
dual processor servers and workstations. The 64-bit Intel Xeon processor with 2 MB L2 cache
is based on Intel’s 90 nanometer process and includes a larger 2 MB, on-die, level 2 (L2)
cache. The processor uses the mPGA604 socket. For this document, “processor” is used as the
generic term for the “64-bit Intel Xeon processor with 2 MB L2 cache”.
64-bit Intel Xeon MV 3.20 GHz processor — Mid-voltage (MV), low-power Intel 64-bit
microprocessor targeted for volumetrically constrained platforms. Unless otherwise noted,
“processor” and “64-bit Intel Xeon processor with 2 MB L2 cache” are used as generic terms
for the “64-bit Intel Xeon MV 3.20 GHz processor”.
64-bit Intel Xeon LV 3 GHz processor — Low-voltage (LV), low-power Intel 64-bit
microprocessor targeted for embedded and volumetrically constrained platforms. Unless
otherwise noted, “processor” and “64-bit Intel Xeon processor with 2 MB L2 cache” are used
as generic terms for the “64-bit Intel Xeon LV 3 GHz processor”.
Central Agent — The central agent is the host bridge to the processor and is typically known
as the chipset.
Demand Based Switching (DBS) with Enhanced Intel SpeedStep Technology — Demand
Based Switching with Enhanced Intel SpeedStep technology is the next generation
implementation of Geyserville technology which extends power management capabilities of
servers and workstations.
Enterprise Voltage Regulator Down (EVRD) — DC-DC converter integrated onto the
system board that provide the correct voltage and current for the processor based on the logic
stat of the VID bits.
Flip Chip Micro Pin Grid Array (FC-mPGA4) Package — The processor package is a Flip
Chip Micro Pin Grid Array (FC-mPGA4), consisting of a processor core mounted on a pinned
substrate with an integrated heat spreader (IHS). This package technology employs a 1.27 mm
[0.05 in.] pitch for the processor pins.
Front Side Bus (FSB) — The electrical interface that connects the processor to the chipset.
Also referred to as the processor system bus or the system bus. All memory and I/O
transactions as well as interrupt messages pass between the processor and the chipset over the
FSB.
Functional Operation — Refers to the normal operating conditions in which all processor
specifications, including DC, AC, system bus, signal quality, mechanical and thermal are
satisfied.
Integrated Heat Spreader (IHS) — A component of the processor package used to enhance
the thermal performance of the package. Component thermal solutions interface with the
processor at the IHS surface.
mPGA604 Socket — The 64-bit Intel Xeon processor with 2 MB L2 cache mates with the
baseboard through this surface mount, 604-pin, zero insertion force (ZIF) socket. See the
mPGA604 Socket Design Guidelines for details regarding this socket.
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