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参数资料
型号： RK80546KG0802MM
厂商： INTEL CORP
元件分类： 微控制器/微处理器
英文描述： 64-BIT, 3000 MHz, MICROPROCESSOR, CPGA604
封装： FLIP CHIP, MICRO PGA-604
文件页数： 77/106页
文件大小： 4724K
代理商： RK80546KG0802MM
72
Datasheet
Thermal Specifications
permanent damage to the processor. Intel has developed these thermal profiles to allow OEMs to
choose the thermal solution and environmental parameters that best suit their platform
implementation. Refer to the appropriate thermal/mechanical design guide for details on system
thermal solution design, thermal profiles, and environmental considerations.
The upper point of the thermal profile consists of the Thermal Design Power (TDP) defined in
Table 6-1 and the associated TCASE value. It should be noted that the upper point associated with
Thermal Profile B (x = TDP and y = TCASE_MAX_B @ TDP) represents a thermal solution design
point. In actuality the processor case temperature will never reach this value due to TCC activation
(see Figure 6-1). The lower point of the thermal profile consists of x = PCONTROL_BASE and y =
TCASE_MAX @ PCONTROL_BASE. Pcontrol is defined as the processor power at which TCASE,
calculated from the thermal profile, corresponds to the lowest possible value of Tcontrol. This point
is associated with the Tcontrol value (see Section 6.2.7) However, because Tcontrol represents a
diode temperature, it is necessary to define the associated case temperature. This is TCASE_MAX @
PCONTROL_BASE. Please see Section 6.2.7 and the appropriate thermal/mechanical design guide for
proper usage of the Tcontrol specification.
The case temperature is defined at the geometric top center of the processor IHS. Analysis
indicates that real applications are unlikely to cause the processor to consume maximum power
dissipation for sustained time periods. Intel recommends that complete thermal solution designs
target the Thermal Design Power (TDP) indicated in Table 6-1, instead of the maximum processor
power consumption. The Thermal Monitor feature is intended to help protect the processor in the
event that an application exceeds the TDP recommendation for a sustained time period. For more
details on this feature, refer to Section 6.2. To ensure maximum flexibility for future requirements,
systems should be designed to the Flexible Motherboard (FMB) guidelines, even if a processor
with a lower thermal dissipation is currently planned. Thermal Monitor or Thermal Monitor 2
feature must be enabled for the processor to remain within specification.
NOTES:
1. These values are specified at VCC_MAX for all processor frequencies. Systems must be designed to ensure
the processor is not to be subjected to any static VCC and ICC combination wherein VCC exceeds VCC_MAX at
specified ICC. Please refer to the VCC static and transient tolerance specifications in Chapter 2.
2. Listed frequencies are not necessarily committed production frequencies.
3. Maximum Power is the maximum thermal power that can be dissipated by the processor through the
integrated heat spreader (IHS). Maximum Power is measured at maximum TCASE.
4. Thermal Design Power (TDP) should be used for processor/chipset thermal solution design targets. TDP is
not the maximum power that the processor can dissipate. TDP is measured at maximum TCASE.
5. These specifications are based on final silicon characterization.
6. Power specifications are defined at all VIDs found in Table 2-8. The 64-bit Intel Xeon processor with 2 MB
L2 cache may be shipped under multiple VIDs listed for each frequency.
7. FMB, or Flexible Motherboard, guidelines provide a design target for meeting all planned processor
frequency requirements. FMB is a design target that is sequential in time.
Table 6-1. 64-bit Intel Xeon Processor with 2 MB L2 Cache Thermal Specifications
Core
Frequency
(GHz)
Maximum
Power
(W)
Thermal
Design Power
(W)
Minimum
TCASE
(°C)
Maximum
TCASE
(°C)
Notes
2.80 GHz - FMB
(PRB = 1)
120
110
5
See Figure 6-1, Table 6-2
or Table 6-3
1,2,3,4,5,6,7
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