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参数资料
| 型号： | RK80546KG0802MM |
| 厂商： | INTEL CORP |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 64-BIT, 3000 MHz, MICROPROCESSOR, CPGA604 |
| 封装： | FLIP CHIP, MICRO PGA-604 |
| 文件页数： | 76/106页 |
| 文件大小： | 4724K |
| 代理商： | RK80546KG0802MM |
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Datasheet
71
6
Thermal Specifications
6.1
Package Thermal Specifications
The 64-bit Intel Xeon processor with 2 MB L2 cache requires a thermal solution to maintain
temperatures within operating limits. Any attempt to operate the processor outside these operating
limits may result in permanent damage to the processor and potentially other components within
the system. As processor technology changes, thermal management becomes increasingly crucial
when building computer systems. Maintaining the proper thermal environment is key to reliable,
long-term system operation.
A complete solution includes both component and system level thermal management features.
Component level thermal solutions can include active or passive heatsinks attached to the
processor Integrated Heat Spreader (IHS). Typical system level thermal solutions may consist of
system fans combined with ducting and venting.
For more information on designing a component level thermal solution, refer to the 64-bit Intel
Xeon Processor with 2 MB L2 Cache Thermal/Mechanical Design Guidelines.
Note:
The boxed processor will ship with a component thermal solution. Refer to Chapter 8 for details on
the boxed processor.
6.1.1
Thermal Specifications
To allow the optimal operation and long-term reliability of Intel processor-based systems, the
processor must remain within the minimum and maximum case temperature (TCASE) specifications
solutions not designed to provide this level of thermal capability may affect the long-term
reliability of the processor and system. For more details on thermal solution design, please refer to
the appropriate processor thermal/mechanical design guideline.
The 64-bit Intel Xeon processor with 2 MB L2 cache uses a methodology for managing processor
temperatures which is intended to support acoustic noise reduction through fan speed control and
assure processor reliability. Selection of the appropriate fan speed will be based on the temperature
reported by the processor’s Thermal Diode. If the diode temperature is greater than or equal to
Tcontrol (see Section 6.2.7), then the processor case temperature must remain at or below the
temperature as specified by the thermal profile (see Figure 6-1). If the diode temperature is less
than Tcontrol, then the case temperature is permitted to exceed the thermal profile, but the diode
temperature must remain at or below Tcontrol. Systems that implement fan speed control must be
designed to take these conditions into account. Systems that do not alter the fan speed only need to
guarantee the case temperature meets the thermal profile specifications.
Intel has developed two thermal profiles, either of which can be implemented with the 64-bit Intel
Xeon processor with 2 MB L2 cache. Both ensure adherence to Intel reliability requirements.
Thermal Profile A is representative of a volumetrically unconstrained thermal solution (i.e.
industry enabled 2U heatsink). In this scenario, it is expected that the Thermal Control Circuit
(TCC) would only be activated for very brief periods of time when running the most power
intensive applications. Thermal Profile B is indicative of a constrained thermal environment (i.e.
1U). Because of the reduced cooling capability represented by this thermal solution, the probability
of TCC activation and performance loss is increased. Additionally, utilization of a thermal solution
that does not meet Thermal Profile B will violate the thermal specifications and may result in
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相关代理商/技术参数 |
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|---|---|
| RK80546KG0802MMS L7ZF | 制造商:Intel 功能描述:MPU Xeon NetBurst 64-Bit 90nm 3GHz 604-Pin FCmPGA4 制造商:Intel 功能描述:XEON 3E GHZ,2M,800MHZ,FC MPGA4 - Trays |
| RK80546KG0881M S L7PF | 制造商:Intel 功能描述:INTEL XEON, 3.2DGHZ,1M,800MHZ,FC-MPGA4 - Trays |
| RK80546KG0882MMS L7ZE | 制造商:Intel 功能描述:XEON 3.2,2M,800MHZ,FC-MPGA4 - Trays |
| RK80546KG1041M | 制造商:Rochester Electronics LLC 功能描述:XEON 3.6GHZ,1M,800MHZ,FC MPGA4 - Bulk |
| RK80546KG1041M S L7PH | 制造商:Intel 功能描述:MPU Xeon 制造商:Intel 功能描述:MPU XEON 90NM 3.6GHZ 604PIN PGA - Trays |
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