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参数资料
型号： RK80546KG0802MM
厂商： INTEL CORP
元件分类： 微控制器/微处理器
英文描述： 64-BIT, 3000 MHz, MICROPROCESSOR, CPGA604
封装： FLIP CHIP, MICRO PGA-604
文件页数： 41/106页
文件大小： 4724K
代理商： RK80546KG0802MM
4
Datasheet
6.1.2
Thermal Metrology ................................................................................. 78
6.2
Processor Thermal Features............................................................................... 79
6.2.1
Thermal Monitor ..................................................................................... 79
6.2.2
Thermal Monitor 2 .................................................................................. 79
6.2.3
On-Demand Mode.................................................................................. 81
6.2.4
PROCHOT# Signal Pin .......................................................................... 81
6.2.5
FORCEPR# Signal Pin .......................................................................... 81
6.2.6
THERMTRIP# Signal Pin ....................................................................... 82
6.2.7
TCONTROL and Fan Speed Reduction................................................. 82
6.2.8
Thermal Diode........................................................................................ 82
7
Features ........................................................................................................................... 85
7.1
Power-On Configuration Options ........................................................................ 85
7.2
Clock Control and Low Power States.................................................................. 85
7.2.1
Normal State .......................................................................................... 86
7.2.2
HALT or Enhanced HALT Power Down States ...................................... 86
7.2.3
Stop Grant State .................................................................................... 87
7.2.4
Enhanced HALT Snoop or HALT Snoop State, Stop Grant
Snoop State ........................................................................................... 88
7.2.5
Sleep State............................................................................................. 88
7.3
Demand Based Switching (DBS) with Enhanced Intel
SpeedStep Technology..................................................................................... 89
8
Boxed Processor Specifications....................................................................................... 91
8.1
Introduction ......................................................................................................... 91
8.2
Mechanical Specifications ................................................................................... 93
8.2.1
Boxed Processor Heatsink Dimensions (CEK) ...................................... 93
8.2.2
Boxed Processor Heatsink Weight....................................................... 101
8.2.3
Boxed Processor Retention Mechanism and
Heatsink Support (CEK) ....................................................................... 101
8.3
Electrical Requirements .................................................................................... 101
8.3.1
Fan Power Supply (Active CEK) .......................................................... 101
8.3.2
Boxed Processor Cooling Requirements ............................................. 103
8.4
Boxed Processor Contents ............................................................................... 104
9
Debug Tools Specifications............................................................................................ 105
9.1
Debug Port System Requirements.................................................................... 105
9.2
Target System Implementation ......................................................................... 105
9.2.1
System Implementation........................................................................ 105
9.3
Logic Analyzer Interface (LAI) .......................................................................... 105
9.3.1
Mechanical Considerations .................................................................. 106
9.3.2
Electrical Considerations...................................................................... 106
Figures
2-1
Phase Lock Loop (PLL) Filter Requirements ...................................................... 19
2-2
64-bit Intel Xeon Processor and 64-bit Intel Xeon
MV 3.20 GHz Processor Load Current Vs. Time ................................................ 29
2-3
64-bit Intel Xeon LV 3 GHz Processor Load Current Vs. Time ..................... 29
2-4
VCC Static and Transient Tolerance................................................................... 31
2-5
VCC Overshoot Example Waveform................................................................... 32
3-1
Processor Package Assembly Sketch ................................................................ 35
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