参数资料
型号: RK80546KG0802MM
厂商: INTEL CORP
元件分类: 微控制器/微处理器
英文描述: 64-BIT, 3000 MHz, MICROPROCESSOR, CPGA604
封装: FLIP CHIP, MICRO PGA-604
文件页数: 9/106页
文件大小: 4724K
代理商: RK80546KG0802MM
106
Datasheet
Debug Tools Specifications
9.3.1
Mechanical Considerations
The LAI is installed between the processor socket and the processor. The LAI pins plug into the
socket, while the processor pins plug into a socket on the LAI. Cabling that is part of the LAI
egresses the system to allow an electrical connection between the processor and a logic analyzer.
The maximum volume occupied by the LAI, known as the keepout volume, as well as the cable
egress restrictions, should be obtained from the logic analyzer vendor. System designers must
make sure that the keepout volume remains unobstructed inside the system. Note that it is possible
that the keepout volume reserved for the LAI may include differerent requirements from the space
normally occupied by the heatsink. If this is the case, the logic analyzer vendor will provide a
cooling solution as part of the LAI.
9.3.2
Electrical Considerations
The LAI will also affect the electrical performance of the front side bus, therefore it is critical to
obtain electrical load models from each of the logic analyzer vendors to be able to run system level
simulations to prove that their tool will work in the system. Contact the logic analyzer vendor for
electrical specifications and load models for the LAI solution they provide.
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