- 您现在的位置：买卖IC网 > PDF目录69322 > RK80546KG0802MM (INTEL CORP) 64-BIT, 3000 MHz, MICROPROCESSOR, CPGA604 PDF资料下载
参数资料
| 型号： | RK80546KG0802MM |
| 厂商： | INTEL CORP |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 64-BIT, 3000 MHz, MICROPROCESSOR, CPGA604 |
| 封装： | FLIP CHIP, MICRO PGA-604 |
| 文件页数： | 42/106页 |
| 文件大小： | 4724K |
| 代理商： | RK80546KG0802MM |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页第30页第31页第32页第33页第34页第35页第36页第37页第38页第39页第40页第41页当前第42页第43页第44页第45页第46页第47页第48页第49页第50页第51页第52页第53页第54页第55页第56页第57页第58页第59页第60页第61页第62页第63页第64页第65页第66页第67页第68页第69页第70页第71页第72页第73页第74页第75页第76页第77页第78页第79页第80页第81页第82页第83页第84页第85页第86页第87页第88页第89页第90页第91页第92页第93页第94页第95页第96页第97页第98页第99页第100页第101页第102页第103页第104页第105页第106页
40
Datasheet
Mechanical Specifications
3.4
Package Handling Guidelines
Table 3-2 includes a list of guidelines on a package handling in terms of recommended maximum
loading on the processor IHS relative to a fixed substrate. These package handling loads may be
experienced during heatsink removal.
NOTES:
1. A shear load is defined as a load applied to the IHS in a direction parallel to the IHS top surface.
2. A tensile load is defined as a pulling load applied to the IHS in a direction normal to the IHS surface.
3. A torque load is defined as a twisting load applied to the IHS in an axis of rotation normal to the IHS top
surface.
4. These guidelines are based on limited testing for design characterization and incidental applications (one
time only).
5. Handling guidelines are for the package only and do not include the limits of the processor socket.
3.5
Package Insertion Specifications
The processor can be inserted and removed 15 times from an mPGA604 socket, which meets the
criteria outlined in the mPGA604 Socket Design Guidelines.
3.6
Processor Mass Specifications
The typical mass of the 64-bit Intel Xeon processor with 2 MB L2 cache is 25 grams [0.88 oz.].
This mass [weight] includes all components which make up the entire processor product.
3.7
Processor Materials
The processor is assembled from several components. The basic material properties are described
in Table 3-3.
Table 3-2. Package Handling Guidelines
Parameter
Maximum Recommended
Notes
Shear
356 N
80 lbf
1,4,5
Tensile
156 N
35 lbf
2,4,5
Torque
8 N-m
70 lbf-in
3,4,5
Table 3-3. Processor Materials
Component
Material
Integrated Heat Spreader (IHS)
Nickel over copper
Substrate
Fiber-reinforced resin
Substrate Pins
Gold over nickel
相关PDF资料 |
PDF描述 |
|---|---|
| RK80546PG0801M | 32-BIT, 3000 MHz, MICROPROCESSOR, CPGA478 |
| RK80546PE0721M | 32-BIT, 2800 MHz, MICROPROCESSOR, CPGA478 |
| RL5C478A | PCI BUS CONTROLLER, PQFP256 |
| RM100355WFQMLV | 100K SERIES, LOW LEVEL TRIGGERED D LATCH, COMPLEMENTARY OUTPUT, CQFP24 |
| RM48L950PGET | 32-BIT, FLASH, 200 MHz, RISC MICROCONTROLLER, PQFP144 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| RK80546KG0802MMS L7ZF | 制造商:Intel 功能描述:MPU Xeon NetBurst 64-Bit 90nm 3GHz 604-Pin FCmPGA4 制造商:Intel 功能描述:XEON 3E GHZ,2M,800MHZ,FC MPGA4 - Trays |
| RK80546KG0881M S L7PF | 制造商:Intel 功能描述:INTEL XEON, 3.2DGHZ,1M,800MHZ,FC-MPGA4 - Trays |
| RK80546KG0882MMS L7ZE | 制造商:Intel 功能描述:XEON 3.2,2M,800MHZ,FC-MPGA4 - Trays |
| RK80546KG1041M | 制造商:Rochester Electronics LLC 功能描述:XEON 3.6GHZ,1M,800MHZ,FC MPGA4 - Bulk |
| RK80546KG1041M S L7PH | 制造商:Intel 功能描述:MPU Xeon 制造商:Intel 功能描述:MPU XEON 90NM 3.6GHZ 604PIN PGA - Trays |
发布紧急采购，3分钟左右您将得到回复。