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参数资料
| 型号： | RK80546KG0802MM |
| 厂商： | INTEL CORP |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 64-BIT, 3000 MHz, MICROPROCESSOR, CPGA604 |
| 封装： | FLIP CHIP, MICRO PGA-604 |
| 文件页数： | 80/106页 |
| 文件大小： | 4724K |
| 代理商： | RK80546KG0802MM |
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Datasheet
75
Thermal Specifications
NOTES:
1. These values are specified at VCC_MAX for all processor frequencies. Systems must be designed to ensure
the processor is not to be subjected to any static VCC and ICC combination wherein VCC exceeds VCC_MAX at
2. Listed frequencies are not necessarily committed production frequencies.
3. Maximum Power is the maximum thermal power that can be dissipated by the processor through the
integrated heat spreader (IHS). Maximum Power is measured at maximum TCASE.
4. Thermal Design Power (TDP) should be used for processor/chipset thermal solution design targets. TDP is
not the maximum power that the processor can dissipate. TDP is measured at maximum TCASE.
5. These specifications are based on pre-silicon estimates.
6. Power specifications are defined at all VIDs found in Table 2-3. The 64-bit Intel
Xeon
MV processor may
be shipped under multiple VIDs listed for each frequency.
NOTES:
1. Thermal Profile A is representative of a volumetrically unconstrained platform. Please refer to Table 6-5 for
discrete points that constitute the thermal profile.
2. Implementation of Thermal Profile A should result in virtually no TCC activation. Furthermore, utilization of
thermal solutions that do not meet processor Thermal Profile A will result in increased probability of TCC
activation and may incur measurable performance loss. (See Section 6.2 for details on TCC activation).
3. Thermal Profile B is representative of a volumetrically constrained platform. Please refer to Table 6-6 for
discrete points that constitute the thermal profile.
4. Implementation of Thermal Profile B will result in increased probability of TCC activation and may incur
measurable performance loss. Furthermore, utilization of thermal solutions that do not meet Thermal Profile
B do not meet the processor’s thermal specifications and may result in permanent damage to the processor.
Table 6-4. 64-bit Intel Xeon MV 3.20 GHz Processor Thermal Specifications
Core
Frequency
(GHz)
Maximum
Power
(W)
Thermal
Design Power
(W)
Minimum
TCASE
(°C)
Maximum
TCASE
(°C)
Notes
3.20 GHz
(PRB = 1)
97
90
5
See Figure 6-2,
1,2,3,4,5,6
Figure 6-2. 64-bit Intel Xeon MV 3.20 GHz Processor Thermal Profiles A and B (PRB = 1)
0
10
20
30
40
50
60
70
80
0
1020
30
40
5060
7080
90
100
Pow er [W]
T
cas
e
[
°C
]
PCONTROL_BASE_B
PCONTROL_BASE_A
TCASE MAX_B @
TDP
TCASE MAX_A @
TDP
TCASE MAX @
PCONTROL_BASE
Thermal Profile B
y = 0.320 * x +42.8
Thermal Profile A
y = 0.270 * x +42.5
TCASE_MAX_B is a thermal
solution design point. In
actuality, units will not
exceed TCASE_MAX_A due to
TCC activation.
TDP
0
10
20
30
40
50
60
70
80
0
1020
30
40
5060
7080
90
100
Pow er [W]
T
cas
e
[
°C
]
PCONTROL_BASE_B
PCONTROL_BASE_A
TCASE MAX_B @
TDP
TCASE MAX_A @
TDP
TCASE MAX @
PCONTROL_BASE
Thermal Profile B
y = 0.320 * x +42.8
Thermal Profile A
y = 0.270 * x +42.5
TCASE_MAX_B is a thermal
solution design point. In
actuality, units will not
exceed TCASE_MAX_A due to
TCC activation.
TDP
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