参数资料
型号: ZL50114GAG2
厂商: XILINX INC
元件分类: 通信及网络
英文描述: SPECIALTY TELECOM CIRCUIT, PBGA552
封装: 35 X 35 MM, 1.27 MM PITCH, LEAD FREE, PLASTIC, MS-034, BGA-552
文件页数: 28/113页
文件大小: 2004K
代理商: ZL50114GAG2
ZL50110/11/12/14
Data Sheet
21
Zarlink Semiconductor Inc.
L15
GND
L16
GND
L18
VDD_IO
L21
M1_RXER
L22
M1_TXCLK
L23
M1_CRS
L24*
M3_TXD[0]
L25*
M3_TXD[1]
L26*
M3_TXD[2]
M1
RAM_ADDR[5]
M2
RAM_ADDR[4]
M3
RAM_ADDR[2]
M4
RAM_ADDR[3]
M5
RAM_ADDR[0]
M6
RAM_ADDR[1]
M9
VDD_IO
M11
GND
M12
GND
M13
GND
M14
GND
M15
GND
M16
GND
M18
VDD_IO
M21
VDD_CORE
M22
M1_REFCLK
M23
M1_RXCLK
M24
M1_RXD[5]
M25
M1_RXD[7]
M26
M1_RXDV
N1
GND
N2
RAM_ADDR[6]
N3
RAM_ADDR[7]
N4
RAM_ADDR[8]
N5
GND
N6
VDD_CORE
N9
VDD_IO
N11
GND
N12
GND
Ball
Number
Signal Name
N13
GND
N14
GND
N15
GND
N16
GND
N18
VDD_IO
N21
M1_GTX_CLK
N22
GND
N23
M1_TXER
N24
M1_RXD[2]
N25
M1_RXD[3]
N26
GND
P1
RAM_ADDR[9]
P2
RAM_ADDR[10]
P3
RAM_ADDR[11]
P4
RAM_ADDR[13]
P5
RAM_ADDR[16]
P6
GND
P9
VDD_IO
P11
GND
P12
GND
P13
GND
P14
GND
P15
GND
P16
GND
P18
VDD_IO
P21
M1_TXD[2]
P22
M1_TXD[6]
P23
M1_TXEN
P24
GND
P25
M1_RXD[4]
P26
M1_RXD[6]
R1
RAM_ADDR[12]
R2
RAM_ADDR[14]
R3
RAM_ADDR[15]
R4
RAM_ADDR[19]
R5
IC_GND
R6
IC
R9
VDD_IO
Ball
Number
Signal Name
R11
GND
R12
GND
R13
GND
R14
GND
R15
GND
R16
GND
R18
VDD_IO
R21
M1_TXD[0]
R22
M1_TXD[3]
R23
M1_TXD[5]
R24
M1_TXD[7]
R25
M1_COL
R26
M1_RXD[1]
T1
RAM_ADDR[17]
T2
RAM_ADDR[18]
T3
RAM_BW_B
T4
IC_GND
T5
GND
T6
A1VDD
T9
VDD_IO
T11
GND
T12
GND
T13
GND
T14
GND
T15
GND
T16
GND
T18
VDD_IO
T21
VDD_CORE
T22
M1_TXD[1]
T23
M1_TXD[4]
T24
GND
T25
M1_RBC1
T26
M1_RXD[0]
U1
PLL_PRI
U2
RAM_BW_A
U3
RAM_BW_C
U4
RAM_RW
U5
SYSTEM_DEBUG
Ball
Number
Signal Name
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