VCC Thermal Specifications
R
Mobile Intel
Pentium III Processor-M Datasheet
75
6.
VCC Thermal Specifications
In order to achieve proper cooling of the processor, a thermal solution (e.g., heat spreader, heat pipe, or
other heat transfer system) must make firm contact to the exposed processor die. The processor die
must be clean before the thermal solution is attached or the processor may be damaged.
Table 43 provides the Thermal Design Power (TDP) dissipation and the minimum and maximum TJ
temperatures for the Mobile Intel Pentium III Processor-M. The thermal solution should be designed to
ensure the junction temperature never exceeds the 100
°C TJ specification while operating at the
Thermal Design Power. Additionally, a secondary failsafe mechanism in hardware should be provided
to shutdown the processor at 101
°C to prevent permanent damage, as described in Section 3.1.3. TDP
is a thermal design power specification based on the worst case power dissipation of the processor
while executing publicly available software under normal operating conditions at nominal voltages.
Contact your Intel Field Sales Representative for further information.
Table 43. Power Specifications for Mobile Intel Pentium III Processor-M
Symbol
Core Frequency/Voltage
Thermal Design Power
Unit
Notes
TDP
Thermal Design Power at
300 MHz & 0.95 V
350 MHz & 0.95 V
400 MHz & 0.95 V
450 MHz & 1.05 V
466 MHz & 1.05 V
500 MHz & 1.05 V
533 MHz & 1.05 V
700 MHz & 1.10 V
733 MHz & 1.10 V
750 MHz & 1.10 V
800 MHz & 1.10 V
850 MHz & 1.10 V
866 MHz & 1.10 V
900 MHz & 1.10 V
933 MHz & 1.10 V
667 MHz & 1.15 V
733 MHz & 1.15 V
750 MHz & 1.15 V
800 MHz & 1.15 V
850 MHz & 1.15 V
866 MHz & 1.15 V
933 MHz & 1.15 V
1.000 GHz & 1.15 V
866 MHz & 1.40 V
933 MHz & 1.40 V
1.000 GHz & 1.40 V
1.066 GHz & 1.40 V
1.133 GHz & 1.40 V
1.200 GHz & 1.40 V
1.266 GHz & 1.40V
1.333 GHz & 1.40V
3.3
3.5
3.8
5.7
5.8
5.9
6.1
7.0
8.9
9.3
9.4
9.25
10.0
10.1
10.5
11.0
19.5
20.1
20.5
21.0
21.8
22.0
W
At 100°C, Note 1
Notes 1, 4