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参数资料
| 型号： | RJ80530LZ001512 |
| 厂商： | INTEL CORP |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 32-BIT, 1000 MHz, MICROPROCESSOR, CPGA478 |
| 封装： | MICRO, FCPGA-478 |
| 文件页数： | 74/96页 |
| 文件大小： | 2018K |
| 代理商： | RJ80530LZ001512 |
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VCC Thermal Specifications
R
76
Mobile Intel
Pentium III Processor-M Datasheet
Symbol
Parameter
Min
Max
Unit
Notes
PAH
Auto Halt power at
0.95 V
1.05 V
1.10 V
1.15 V
1.40 V
1.0
2.0
1.9
3.0
7.0
W
At 50°C, Note 2
Notes 2, 4
PQS
Quick Start power at
0.95 V
1.05 V
1.10 V
1.15 V
1.40 V
0.9
1.8
1.7
2.7
6.5
W
At 50°C, Note 2
Notes 2, 4
PDSLP
Deep Sleep power at
0.95 V
1.05 V
1.10 V
1.15 V
1.40 V
0.7
1.3
1.6
2.0
4.8
W
At 35°C, Note 2
Notes 2, 4
PDPRSLP
Deeper Sleep power
at 0.85 V
0.62
W
At 35°C, Note 2
PDPRSLPULV
Deeper Sleep power
at 0.85 V
0.47
W
At 35°C, Notes 2, 4
TJ
Junction Temperature
0
100
°C
Note 3
NOTES:
1.
TDP is defined as the worst case power dissipated by the processor while executing publicly available software
under normal operating conditions at nominal voltages that meet the load line specifications. The TDP number
shown is a specification based on Icc(maximum) and indirectly tested by Icc(maximum) testing. TDP definition
is synonymous with the Thermal Design Power (typical) specification referred to in previous Intel datasheets.
The Intel TDP specification is a recommended design point and is not representative of the absolute maximum
power the processor may dissipate under worst case conditions.
2.
Not 100% tested. These power specifications are determined by characterization of the processor currents at
higher temperatures and extrapolating the values for the temperature indicated.
3.
TJ is measured with the on-die thermal diode.
4.
This specification applies only to the Ultra Low Voltage Mobile Intel Pentium III Processor-M.
6.1
Thermal Diode
The Mobile Intel Pentium III Processor-M has an on-die thermal diode that can be used to monitor the
die temperature (TJ). A thermal sensor located on the motherboard, or a stand-alone measurement kit,
may monitor the die temperature of the processor for thermal management or instrumentation
purposes. Table 44 and Table 45 provide the diode interface and specifications.
Note:
The reading of the thermal sensor connected to the thermal diode will not necessarily reflect the
temperature of the hottest location on the die. This is due to inaccuracies in the thermal sensor, on-die
temperature gradients between the location of the thermal diode and the hottest location on the die, and
time based variations in the die temperature measurement. Time based variations can occur when the
sampling rate of the thermal diode (by the thermal sensor) is slower than the rate at which the TJ
temperature can change.
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