参数资料
型号: W9725G6IB-18
厂商: WINBOND ELECTRONICS CORP
元件分类: DRAM
英文描述: 16M X 16 DDR DRAM, 0.35 ns, PBGA84
封装: 8 X 12.50 MM, ROHS COMPLIANT, WBGA-84
文件页数: 66/69页
文件大小: 1644K
代理商: W9725G6IB-18
PRELIMINARY W9725G6IB
Publication Release Date:Nov. 14, 2008
- 69 -
Revision P04
12. REVISION HISTORY
VERSION
DATE
PAGE
DESCRIPTION
P00
Oct. 25, 2007
Preliminary data sheet
P01
Nov. 08, 2007
Revise CAS Latency vs. clock frequency as below
–200MHZ, (CL-tRCD-tRP) 3-3-3
–266MHz, (CL-tRCD-tRP) 4-4-4
–333MHz, (CL-tRCD-tRP) 5-5-5
–400MHz, (CL-tRCD-tRP) 6-6-6
–533MHz, (CL-tRCD-tRP) 7-7-7
18, 19
Add section 7.2.5 ODT related timings in Function
Description
P02
Mar. 11, 2008
46
Revise tDQSCK parameter value in AC
Characteristics and Operating Condition for
DDR2-1066 (-18) speed grade table follow
JEDEC speciality DDR2-1066 SDRAM standard
P03
Jun. 20, 2008
All
Modify part no. from W9725G6AB to W9725G6IB
P04
Nov. 14, 2008
4, 5, 37, 38,
40~49, 68
Remove -37/-5 grade parts and revise -18/-25/-3
speed grades IDDX values and revise package
name from TFBGA-84 to WBGA-84
Important Notice
Winbond products are not designed, intended, authorized or warranted for use as components
in systems or equipment intended for surgical implantation, atomic energy control
instruments, airplane or spaceship instruments, transportation instruments, traffic signal
instruments, combustion control instruments, or for other applications intended to support or
sustain life. Further more, Winbond products are not intended for applications wherein failure
of Winbond products could result or lead to a situation wherein personal injury, death or
severe property or environmental damage could occur.
Winbond customers using or selling these products for use in such applications do so at their
own risk and agree to fully indemnify Winbond for any damages resulting from such improper
use or sales.
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