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| 型号： | W9725G6IB-18 |
| 厂商： | WINBOND ELECTRONICS CORP |
| 元件分类： | DRAM |
| 英文描述： | 16M X 16 DDR DRAM, 0.35 ns, PBGA84 |
| 封装： | 8 X 12.50 MM, ROHS COMPLIANT, WBGA-84 |
| 文件页数： | 67/69页 |
| 文件大小： | 1644K |
| 代理商： | W9725G6IB-18 |
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PRELIMINARY W9725G6IB
Publication Release Date:Nov. 14, 2008
- 7 -
Revision P04
5. BALL DESCRIPTION
BALL NUMBER
SYMBOL
FUNCTION
DESCRIPTION
M8,M3,M7,N2,N8,N3
,N7,P2,P8,P3,M2,P7
,R2
A0A12
Address
Provide the row address for active commands, and the column
address and Auto-precharge bit for Read/Write commands to select
one location out of the memory array in the respective bank.
Row address: A0A12.
Column address: A0A8. (A10 is used for Auto-precharge)
L2,L3
BA0BA1
Bank Select
BA0BA1 define to which bank an ACTIVE, READ, WRITE or
PRECHARGE command is being applied.
G8,G2,H7,H3,H1,H9
,F1,F9,C8,C2,D7,D3,
D1,D9,B1,B9
DQ0DQ15
Data Input
/ Output
Bi-directional data bus.
K9
ODT
On Die Termination
Control
ODT (registered HIGH) enables termination resistance internal to the
DDR2 SDRAM.
F7,E8
LDQS,
LDQS
LOW Data Strobe
Data Strobe for Lower Byte: Output with read data, input with write
data for source synchronous operation. Edge-aligned with read data,
center-aligned with write data. LDQS corresponds to the data on
DQ0DQ7. LDQS is only used when differential data strobe mode
is enabled via the control bit at EMR (1)[A10 EMRS command].
B7,A8
UDQS,
UDQS
UP Data Strobe
Data Strobe for Upper Byte: Output with read data, input with write
data for source synchronous operation. Edge-aligned with read data,
center-aligned with write data. UDQS corresponds to the data on
DQ8DQ15. UDQS is only used when differential data strobe mode
is enabled via the control bit at EMR (1)[A10 EMRS command].
L8
CS
Chip Select
All
commands
are
masked
when
CS
is
registered
HIGH
. CS provides for external bank selection on systems with
multiple ranks. CS is considered part of the command code.
K7,L7,K3
RAS , CAS ,
WE
Command Inputs
RAS , CAS and WE (along with CS ) define the command being
entered.
B3,F3
UDM
LDM
Input Data Mask
DM is an input mask signal for write data. Input data is masked
when DM is sampled high coincident with that input data during a
Write access. DM is sampled on both edges of DQS. Although DM
pins are input only, the DM loading matches the DQ and DQS
loading.
J8,K8
CLK,
CLK
Differential Clock
Inputs
CLK and CLK are differential clock inputs. All address and control
input signals are sampled on the crossing of the positive edge of
CLK and negative edge of CLK . Output (read) data is referenced
to the crossings of CLK and CLK (both directions of crossing).
K2
CKE
Clock Enable
CKE (registered HIGH) activates and CKE (registered LOW)
deactivates clocking circuitry on the DDR2 SDRAM.
J2
VREF
Reference Voltage
VREF is reference voltage for inputs.
A1,E1,J9,M9,R1
VDD
Power Supply
Power Supply: 1.8V ± 0.1V.
A3,E3,J3,N1,P9
VSS
Ground
Ground.
A9,C1,C3,C7,C9,E9,
G1,G3,G7,G9
VDDQ
DQ Power Supply
DQ Power Supply: 1.8V ± 0.1V.
A7,B2,B8,D2,D8,E7,
F2,F8,H2,H8
VSSQ
DQ Ground
DQ Ground. Isolated on the device for improved noise immunity.
A2,E2,L1,R3,R7,R8
NC
No Connection
No connection (NC pin should be connected to GND or floating).
J7
VSSDL
DLL Ground
DLL Ground.
J1
VDDL
DLL Power Supply
DLL Power Supply: 1.8V ± 0.1V.
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相关代理商/技术参数 |
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|---|---|
| W9725G6IB-25 | 功能描述:IC DDR2-800 SDRAM 256MB 84-WBGA RoHS:是 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:1,000 系列:- 格式 - 存储器:EEPROMs - 串行 存储器类型:EEPROM 存储容量:4K (512 x 8) 速度:400kHz 接口:I²C，2 线串口 电源电压:2.7 V ~ 5.5 V 工作温度:-40°C ~ 85°C 封装/外壳:8-SOIC（0.173"，4.40mm 宽） 供应商设备封装:8-MFP 包装:带卷 (TR) |
| W9725G6JB | 制造商:WINBOND 制造商全称:Winbond 功能描述:4M ? 4 BANKS ? 16 BIT DDR2 SDRAM |
| W9725G6JB-25 | 制造商:Winbond Electronics Corp 功能描述:DRAM Chip DDR2 SDRAM 256M-Bit 16Mx16 1.8V 84-Pin WBGA 制造商:Winbond Electronics 功能描述:512MB DDRII |
| W9725G6JB25I | 功能描述:IC DDR2 SDRAM 256MBIT 84WBGA RoHS:是 类别:集成电路 (IC) >> 存储器 系列:- 标准包装:150 系列:- 格式 - 存储器:EEPROMs - 串行 存储器类型:EEPROM 存储容量:4K (2 x 256 x 8) 速度:400kHz 接口:I²C，2 线串口 电源电压:2.5 V ~ 5.5 V 工作温度:-40°C ~ 85°C 封装/外壳:8-VFDFN 裸露焊盘 供应商设备封装:8-DFN（2x3） 包装:管件 产品目录页面:1445 (CN2011-ZH PDF) |
| W9725G6KB-18 | 制造商:Winbond Electronics 功能描述:IC MEMORY 制造商:Winbond Electronics Corp 功能描述:IC MEMORY |
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