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| 型号： | DSRT-L030-011 |
| 厂商： | CONEXANT SYSTEMS |
| 元件分类： | 消费家电 |
| 英文描述： | SPECIALTY CONSUMER CIRCUIT, XMA |
| 文件页数： | 70/86页 |
| 文件大小： | 667K |
| 代理商： | DSRT-L030-011 |
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RipTide PCI Audio/Comm Device Family Product Description
72
ROCKWELL PROPRIETARY INFORMATION
1167
18.1.8
Audio Analog Interface
1.
For the Audio section provide a analog plane separate from modem analog plane. They can connect at a common point
closer to the PCI connector.
18.1.9
DAA
1.
Provide 40 mil minimum spacing between all DAA traces.
2.
Starting with the connectors, place all EMI filters as close to the connector as possible. Don’t let any digital signals get
within 100 mils of the filtered signal. Note: Digital ground is a digital signal.
3.
Place the solid state surge protection device.
4.
Place the ring detect circuit. Place one-half of the ring detect optical-coupler over digital ground.
5.
Place the off hook relay and the electronic inductor.
6.
Place the transformer.
18.1.10 Ground and Power Planes
1.
The ground and power planes are: GND, AGND, MAGND, CHGND, +5V, VCORE, 3.3V, VAUX, PCI_3.3V, VIO, +12V,
-12V, +5VA, +5VJS.
2.
The digital ground plane needs good unimpaired paths to the bracket. This provides a path for board noise to the chassis
which is designed to handle it.
3.
Use many vias between ground planes on opposite sides of two layer boards. This helps keep all of the grounds at the
same potential.
4.
Ensure that all power and ground traces are at least 25 mil wide.
5.
When using vias on power and ground signals, use at least three vias per ground or power trace crossing from one layer
to the other.
6.
Provide a MAGND plane between the AMC’97 Codec and signals to the DAA section.
7.
Provide a AGND plane between AMC’97 Codec and the audio connectors.
18.1.11 Mass Production
1.
If designing for mass production, keep the symmetric trace connection to surface mount discrete components. This
keeps the parts from twisting in production during solder flow. See the following example:
Good
Undesired
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