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| 型号： | RN80532KC0412M |
| 厂商： | INTEL CORP |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 2000 MHz, MICROPROCESSOR, CPGA603 |
| 封装： | Interposer, Micro, PGA-603 |
| 文件页数： | 102/132页 |
| 文件大小： | 2316K |
| 代理商： | RN80532KC0412M |
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Intel Xeon Processor MP with up to 2MB L3 Cache
5-3
Thermal Specifications
5.1
Thermal Specifications
To assure the optimal operation and long-term reliability of Intel Xeon processor-based systems,
the system/processor thermal solution should be designed such that the processor remains between
the minimum and maximum case temperature (TC) specifications when operating at or below the
Thermal Design Power (TDP) value listed per frequency in Table 33.Thermal solutions not
designed to provide this level of thermal capability may affect the long-term reliability of the
processor and system. For more details on thermal solution design, please refer to the appropriate
processor thermal design guidelines.
The case temperature is defined at the geometric top center of the processor IHS (Integrated Heat
Spreader). Analysis indicates that real applications are unlikely to cause the processor to consume
maximum power dissipation for sustained time periods. Intel recommends that complete thermal
solution designs target the Thermal Design Power (TDP) indicated in Table 33 instead of the
maximum processor power consumption. The Thermal Monitor feature is intended to help protect
the processor in the unlikely event that an application exceeds the TDP recommendation for a
sustained period of time. For more details on the usage of this feature, refer to Section 6.3. To
ensure maximum flexibility for future requirements, systems should be designed to the Flexible
Motherboard Guidelines (FMB), even if a processor with a lower thermal dissipation is currently
planned. In all cases, the Thermal Monitor feature must be enabled for the processor to remain
within specification
.
NOTES:
1. Maximum Processor Power is the maximum thermal power that can be dissipated by the processor through
the integrated heat spreader.
2. Intel recommends that thermal solutions be designed to meet the Thermal Design Power guidelines. Refer to
the Intel Xeon Processor (MP) Thermal Design Guidelines.
3. TDP values are specified at the point on Vcc_max loadline corresponding to Icc_TDP.
4. Systems must be designed to ensure that the processor is not subjected to any static Vcc and Icc
combination wherein Vcc exceeds Vcc_max at specified Icc. Please refer to the loadline specifications in
5. Values are based on the latest silicon available at the time of publication. Any updates will be provided in a
future revision of this document.
6. Actual specifications for future processor frequencies may be different.
7. TCASE values are based on Intel reference heatsink with psi_ca of 0.33 C/W. Refer to the Intel Xeon
Processor (MP) Thermal Design Guidelines
for details.
Table 33. Intel Xeon Processor MP on the 0.13 Micron Process Processor Thermal Design
Power
Core Frequency
Maximum
Processor
Power 1 (W)
Thermal Design
Power 2
(W)
Minimum
TCASE
(°C)
Maximum
TCASE 7
(°C)
Note3, 4
Processor with 2-MB
L3 Cache
2 GHz
65
57
5
69
2.80 Ghz
83
72
5
69
Processor 1-MB L3
Cache
1.50 GHz
54
48
5
67
1.90 GHz
63
55
5
68
2 GHz
65
57
5
69
2.50 GHz
74
66
5
70
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相关代理商/技术参数 |
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| RN80532KC041512 | 制造商:Intel 功能描述:TRAY XEON 2.0GHZ 400MZH FSB - Trays 制造商:Rochester Electronics LLC 功能描述:- Bulk |
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| RN80532KC041512 SL6EM | 制造商:Intel 功能描述:MPU XEON 0.13UM 2GHZ 603-PIN UFCBGA - Trays |
| RN80532KC041512S L5Z9 | 制造商:Intel 功能描述:MPU Xeon? Processor 0.13um 2GHz 603-Pin uFCBGA |
| RN80532KC041512S L6W6 | 制造商:Intel 功能描述:MPU Xeon? Processor 0.13um 2GHz 603-Pin uFCBGA |
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