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参数资料
型号： RN80532KC0412M
厂商： INTEL CORP
元件分类： 微控制器/微处理器
英文描述： 2000 MHz, MICROPROCESSOR, CPGA603
封装： Interposer, Micro, PGA-603
文件页数： 89/132页
文件大小： 2316K
代理商： RN80532KC0412M
vi
Intel Xeon Processor MP with up to 2MB L3 Cache
(Package Example) .......................................................................................................... 4-9
35
Intel
Xeon Processor MP on the 0.13 Micron Process Processor Bottom-Side Markings
(Package Example) ........................................................................................................ 4-10
36
Intel
Xeon Processor MP on the 0.13 Micron Process Processor and Intel Xeon Pro-
cessor with 512-KB L2 Cache in INT-mPGA Package - Pinout Diagram - Top View 4-11
37
Intel
Xeon Processor MP on the 0.13 Micron Process Processor and Intel Xeon Pro-
cessor with 512-KB L2 Cache in INT-mPGA Package - Pinout Diagram - Bottom View..
4-12
38
Thermal and Mechanical Components - Exploded View................................................ 5-1
39
Intel
Xeon Processor MP on the 0.13 Micron Process Processor Thermal Design Power
vs. Electrical Projections ................................................................................................. 5-4
40
Thermal Measurement Point for Processor TCASE........................................................ 5-5
41
Stop Clock State Machine ............................................................................................... 6-2
42
Logical Schematic of SMBus Circuitry........................................................................... 6-5
43
Mechanical Representation of the Boxed Intel
Xeon Processor MP on the 0.13 Micron
Process Processor Passive Heatsink ................................................................................ 7-1
44
Boxed Processor Clip ...................................................................................................... 7-3
45
Boxed Processor Retention Mechanism .......................................................................... 7-3
46
Multiple View Space Requirements for Boxed Processors............................................. 7-4
Tables
1
Feature Table for Intel
Xeon Processor MP on the 0.13 Micron Process ......................
......................................................................................................................................... 1-2
2
Core Frequency to System Bus Multiplier Configuration............................................... 2-3
3
System Bus Clock Frequency Select Truth Table for BSEL[1:0]................................... 2-3
4
Voltage Identification Definition..................................................................................... 2-7
5
System Bus Signal Groups .............................................................................................. 2-9
6
Processor Absolute Maximum Ratings ......................................................................... 2-10
7
Voltage and Current Specifications ............................................................................... 2-11
8
System Bus Differential BCLK DC Specifications....................................................... 2-13
9
AGTL+ Signal Group DC Specifications...................................................................... 2-14
10
PWRGOOD and TAP Signal Group DC Specifications ............................................... 2-14
11
Asynchronous GTL+ Signal Group DC Specifications ................................................ 2-15
12
SMBus Signal Group DC Specifications....................................................................... 2-15
13
BSEL[1:0] and VID[4:0] DC Specifications................................................................. 2-15
14
AGTL+ Bus Voltage Definitions .................................................................................. 2-17
15
System Bus Differential Clock AC Specifications....................................................... 2-18
16
System Bus Common Clock AC Specifications............................................................ 2-18
17
System Bus Source Synchronous AC Specifications .................................................... 2-19
18
Miscellaneous Signals AC Specifications ..................................................................... 2-20
19
System Bus AC Specifications (Reset Conditions)....................................................... 2-20
20
TAP Signal Group AC Specifications ........................................................................... 2-21
21
SMBus Signal Group AC Specifications....................................................................... 2-21
22
BCLK Signal Quality Specifications............................................................................... 3-1
23
Ringback Specifications for AGTL+ and Asynchronous GTL+ Buffers........................ 3-2
24
Ringback Specifications for PWRGOOD Input and TAP Buffers.................................. 3-3
25
Intel
Xeon Processor MP on the 0.13 Micron Process Processor Source Synchronous
AGTL+ Signal Group (Data) Overshoot/Undershoot Tolerance .........................................
......................................................................................................................................... 3-8
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相关代理商/技术参数
参数描述
RN80532KC041512 制造商:Intel 功能描述:TRAY XEON 2.0GHZ 400MZH FSB - Trays 制造商:Rochester Electronics LLC 功能描述:- Bulk
RN80532KC041512 SL5Z9 制造商:Intel 功能描述:MPU XEON 0.13UM 2GHZ 603-PIN UFCBGA - Trays
RN80532KC041512 SL6EM 制造商:Intel 功能描述:MPU XEON 0.13UM 2GHZ 603-PIN UFCBGA - Trays
RN80532KC041512S L5Z9 制造商:Intel 功能描述:MPU Xeon? Processor 0.13um 2GHz 603-Pin uFCBGA
RN80532KC041512S L6W6 制造商:Intel 功能描述:MPU Xeon? Processor 0.13um 2GHz 603-Pin uFCBGA
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