- 您现在的位置：买卖IC网 > PDF目录69323 > RN80532KC0412M (INTEL CORP) 2000 MHz, MICROPROCESSOR, CPGA603 PDF资料下载
参数资料
| 型号： | RN80532KC0412M |
| 厂商： | INTEL CORP |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 2000 MHz, MICROPROCESSOR, CPGA603 |
| 封装： | Interposer, Micro, PGA-603 |
| 文件页数： | 109/132页 |
| 文件大小： | 2316K |
| 代理商： | RN80532KC0412M |
第1页第2页第3页第4页第5页第6页第7页第8页第9页第10页第11页第12页第13页第14页第15页第16页第17页第18页第19页第20页第21页第22页第23页第24页第25页第26页第27页第28页第29页第30页第31页第32页第33页第34页第35页第36页第37页第38页第39页第40页第41页第42页第43页第44页第45页第46页第47页第48页第49页第50页第51页第52页第53页第54页第55页第56页第57页第58页第59页第60页第61页第62页第63页第64页第65页第66页第67页第68页第69页第70页第71页第72页第73页第74页第75页第76页第77页第78页第79页第80页第81页第82页第83页第84页第85页第86页第87页第88页第89页第90页第91页第92页第93页第94页第95页第96页第97页第98页第99页第100页第101页第102页第103页第104页第105页第106页第107页第108页当前第109页第110页第111页第112页第113页第114页第115页第116页第117页第118页第119页第120页第121页第122页第123页第124页第125页第126页第127页第128页第129页第130页第131页第132页
Features
6-4
Intel Xeon Processor MP with up to 2MB L3 Cache
6.2.6
Bus Response during Low Power States
While in AutoHALT Power Down and Stop-Grant states, the processor will process a system bus
snoop.
When the processor is in Sleep state, the processor will not process interrupts or snoop
transactions.
6.3
Thermal Monitor
The Thermal Monitor feature helps control the processor temperature by activating the Thermal
Control Circuit (TCC) when the processor silicon reaches its maximum operating temperature. The
TCC reduces processor power consumption by modulating (starting and stopping) the internal
processor core clocks. The Thermal Monitor feature must be enabled for the processor to be
operating within specifications. The temperature at which Thermal Monitor activates the thermal
control circuit is not user configurable and is not software visible. Bus traffic is snooped in the
normal manner, and interrupt requests are latched (and serviced during the time that the clocks are
on) while the TCC is active.
When the Thermal Monitor feature is enabled, and a high temperature situation exists (i.e. TCC is
active), the clocks will be modulated by alternately turning the clocks off and on at a duty cycle
specific to the processor (typically 30-50%). Clocks often will not be off for more than 3.0
microseconds when the TCC is active. Cycle times are processor speed dependent and will
decrease as processor core frequencies increase. A small amount of hysteresis has been included to
prevent rapid active/inactive transitions of the TCC when the processor temperature is near its
maximum operating temperature. Once the temperature has dropped below the maximum
operating temperature, and the hysteresis timer has expired, the TCC goes inactive and clock
modulation ceases.
With a properly designed and characterized thermal solution, it is anticipated that the TCC would
only be activated for very short periods of time when running the most power intensive
applications. The processor performance impact due to these brief periods of TCC activation is
expected to be so minor that it would be immeasurable. An under-designed thermal solution that is
not able to prevent excessive activation of the TCC in the anticipated ambient environment may
cause a noticeable performance loss, and in some cases may result in a TC that exceeds the
specified maximum temperature and may affect the long-term reliability of the processor. In
addition, a thermal solution that is significantly under-designed may not be capable of cooling the
processor even when the TCC is active continuously. Refer to the Intel Xeon Processor Thermal
Design Guidelines for information on designing a thermal solution.
The duty cycle for the TCC, when activated by the Thermal Monitor, is factory configured and
cannot be modified. The Thermal Monitor does not require any additional hardware, software
drivers, or interrupt handling routines.
6.3.1
Thermal Diode
The Intel Xeon processor MP on the 0.13 micron process processor incorporates an on-die thermal
diode. This thermal diode is separate from the Thermal Monitor’s thermal sensor and cannot be
used to predict the behavior of the Thermal Monitor. See Section 6.4.4 for details.
相关PDF资料 |
PDF描述 |
|---|---|
| RN80532KC041512 | 32-BIT, 2000 MHz, MICROPROCESSOR, CPGA603 |
| RP0352 | GRAPHICS PROCESSOR, PQFP80 |
| RP65C02G-06 | 8-BIT, 6 MHz, MICROPROCESSOR, PDIP40 |
| RPIXP2800BC | 32-BIT, 650 MHz, RISC PROCESSOR, PBGA1356 |
| RPIXP2850BB | 32-BIT, 1400 MHz, RISC PROCESSOR, PBGA1356 |
相关代理商/技术参数 |
参数描述 |
|---|---|
| RN80532KC041512 | 制造商:Intel 功能描述:TRAY XEON 2.0GHZ 400MZH FSB - Trays 制造商:Rochester Electronics LLC 功能描述:- Bulk |
| RN80532KC041512 SL5Z9 | 制造商:Intel 功能描述:MPU XEON 0.13UM 2GHZ 603-PIN UFCBGA - Trays |
| RN80532KC041512 SL6EM | 制造商:Intel 功能描述:MPU XEON 0.13UM 2GHZ 603-PIN UFCBGA - Trays |
| RN80532KC041512S L5Z9 | 制造商:Intel 功能描述:MPU Xeon? Processor 0.13um 2GHz 603-Pin uFCBGA |
| RN80532KC041512S L6W6 | 制造商:Intel 功能描述:MPU Xeon? Processor 0.13um 2GHz 603-Pin uFCBGA |
发布紧急采购，3分钟左右您将得到回复。