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参数资料
型号： RN80532KC0412M
厂商： INTEL CORP
元件分类： 微控制器/微处理器
英文描述： 2000 MHz, MICROPROCESSOR, CPGA603
封装： Interposer, Micro, PGA-603
文件页数： 32/132页
文件大小： 2316K
代理商： RN80532KC0412M
29
Intel Confidential
Working page only. Do not distribute.
1
Introduction..........................................................................................................1-1
1.1
Terminology ..................................................................................................1-3
1.1.1
Processor Packaging Terminology ..................................................1-3
1.2
References....................................................................................................1-4
2
Electrical Specifications .................................................................................2-1
2.1
System Bus and GTLREF.............................................................................2-1
2.2
Power and Ground Pins................................................................................2-1
2.3
Decoupling Guidelines ..................................................................................2-1
2.3.1
VCC Decoupling...............................................................................2-2
2.3.2
System Bus AGTL+ Decoupling ......................................................2-2
2.4
System Bus Clock (BCLK[1:0]) and Processor Clocking ..............................2-2
2.4.1
Bus Clock........................................................................................2-3
2.5
PLL Filter.......................................................................................................2-4
2.5.1
Mixing Processors............................................................................2-5
2.6
Voltage Identification....................................................................................2-6
2.6.1
Mixing Processors of Different Voltages ..........................................2-7
2.7
Reserved or Unused Pins .............................................................................2-8
2.8
System Bus Signal Groups ...........................................................................2-8
2.9
Asynchronous GTL+ Signals ........................................................................2-9
2.10
Maximum Ratings .......................................................................................2-10
2.11
Processor DC Specifications ......................................................................2-10
2.12
AGTL+ System Bus Specifications .............................................................2-16
2.13
System Bus AC Specifications....................................................................2-17
2.14
Processor AC Timing Waveforms...............................................................2-22
3
System Bus Signal Quality Specifications..............................................3-1
3.1
System Bus Clock (BCLK) Signal Quality Specifications and Measurement
Guidelines .....................................................................................................3-1
3.2
System Bus Signal Quality Specifications and Measurement Guidelines ....3-2
3.3
System Bus Signal Quality Specifications and Measurement Guidelines ....3-5
3.3.1
Overshoot/Undershoot Guidelines...................................................3-5
3.3.2
Overshoot/Undershoot Magnitude ...................................................3-6
3.3.3
Overshoot/Undershoot Pulse Duration ............................................3-6
3.3.4
Activity Factor ..................................................................................3-6
3.3.5
Reading Overshoot/Undershoot Specification Tables .....................3-7
3.3.6
Determining if a System Meets the Overshoot/Undershoot Specifica-
tions .................................................................................................3-7
4
Mechanical Specifications .............................................................................4-1
4.1
Mechanical Specifications.............................................................................4-3
4.2
Package Load Specifications........................................................................4-8
4.3
Insertion Specifications .................................................................................4-8
4.4
Mass Specifications ......................................................................................4-8
4.5
Materials .......................................................................................................4-9
4.6
Markings .......................................................................................................4-9
4.7
Pinout Diagram ...........................................................................................4-10
5
Thermal Specifications....................................................................................5-1
5.1
Thermal Specifications..................................................................................5-3
5.2
Measurements for Thermal Specifications....................................................5-5
5.2.1
Processor Case Temperature Measurement ...................................5-5
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相关代理商/技术参数
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RN80532KC041512 制造商:Intel 功能描述:TRAY XEON 2.0GHZ 400MZH FSB - Trays 制造商:Rochester Electronics LLC 功能描述:- Bulk
RN80532KC041512 SL5Z9 制造商:Intel 功能描述:MPU XEON 0.13UM 2GHZ 603-PIN UFCBGA - Trays
RN80532KC041512 SL6EM 制造商:Intel 功能描述:MPU XEON 0.13UM 2GHZ 603-PIN UFCBGA - Trays
RN80532KC041512S L5Z9 制造商:Intel 功能描述:MPU Xeon? Processor 0.13um 2GHz 603-Pin uFCBGA
RN80532KC041512S L6W6 制造商:Intel 功能描述:MPU Xeon? Processor 0.13um 2GHz 603-Pin uFCBGA
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