RN80532KC0412M PDF资料下载(67/132 页)2000 MHz, MICROPROCESSOR, CPGA603

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参数资料

型号：	RN80532KC0412M
厂商：	INTEL CORP
元件分类：	微控制器/微处理器
英文描述：	2000 MHz, MICROPROCESSOR, CPGA603
封装：	Interposer, Micro, PGA-603
文件页数：	67/132页
文件大小：	2316K
代理商：	RN80532KC0412M

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Intel Xeon Processor MP with up to 2MB L3 Cache

Thermal Specifications ........................................................................................................ 5-1

5.1

Thermal Specifications .................................................................................................... 5-3

5.2

Measurements for Thermal Specifications ...................................................................... 5-5

5.2.1

Processor Case Temperature Measurement ...................................................... 5-5

Features...................................................................................................................................... 6-1

6.1

Power-On Configuration Options.................................................................................... 6-1

6.2

Clock Control and Low Power States.............................................................................. 6-1

6.2.1

Normal State—State 1....................................................................................... 6-1

6.2.2

AutoHALT Powerdown State—State 2 ............................................................ 6-1

6.2.3

Stop-Grant State—State 3 ................................................................................. 6-2

6.2.4

HALT/Grant Snoop State—State 4................................................................... 6-3

6.2.5

Sleep State—State 5 .......................................................................................... 6-3

6.2.6

Bus Response during Low Power States........................................................... 6-4

6.3

Thermal Monitor..............................................................................................................6-4

6.3.1

Thermal Diode................................................................................................... 6-4

6.4

System Management Bus (SMBus) Interface ................................................................. 6-5

6.4.1

Processor Information ROM (PIROM)............................................................. 6-6

6.4.2

Scratch EEPROM.............................................................................................. 6-8

6.4.3

PIROM and Scratch EEPROM Supported SMBus Transactions ..................... 6-8

6.4.4

SMBus Thermal Sensor .................................................................................... 6-8

6.4.5

Thermal Sensor Supported SMBus Transactions.............................................. 6-9

6.4.6

SMBus Thermal Sensor Registers................................................................... 6-11

6.4.6.1 Thermal Reference Registers............................................................ 6-11

6.4.6.2 Thermal Limit Registers ................................................................... 6-11

6.4.6.3 Status Register .................................................................................. 6-11

6.4.6.4 Configuration Register...................................................................... 6-12

6.4.6.5 Conversion Rate Registers................................................................ 6-13

6.4.7

SMBus Thermal Sensor Alert Interrupt .......................................................... 6-13

6.4.8

SMBus Device Addressing ............................................................................. 6-13

Boxed Processor Specifications ........................................................................................ 7-1

7.1

Introduction ..................................................................................................................... 7-1

7.2

Mechanical Specifications ............................................................................................... 7-2

7.2.1

Boxed Processor Heatsink Dimensions............................................................. 7-2

7.2.2

Boxed Processor Heatsink Weight.................................................................... 7-2

7.2.3

Boxed Processor Retention Mechanism and Heatsink Supports ...................... 7-2

7.3

Boxed Processor Requirements ....................................................................................... 7-5

7.3.1

Intel

Xeon Processor MP on the 0.13 Micron Process Processor....................

........................................................................................................................... 7-5

7.4

Thermal Specifications .................................................................................................... 7-5

7.4.1

Boxed Processor Cooling Requirements........................................................... 7-5

Debug Tools Specifications......................................................................................... 8-1

8.1

Logic Analyzer Interface (LAI)....................................................................................... 8-1

8.1.1

Mechanical Considerations ............................................................................... 8-1

8.1.2

Electrical Considerations................................................................................... 8-1

Pin Listing and Signal Definitions ........................................................................... 9-1

9.1

Intel

Xeon Processor MP on the 0.13 Micron Process Processor Pin Assignments . 9-1

9.1.1

Pin Listing by Pin Number.............................................................................. 9-10

9.2

Signal Definitions .......................................................................................................... 9-19

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相关代理商/技术参数	参数描述
RN80532KC041512	制造商:Intel 功能描述:TRAY XEON 2.0GHZ 400MZH FSB - Trays 制造商:Rochester Electronics LLC 功能描述:- Bulk
RN80532KC041512 SL5Z9	制造商:Intel 功能描述:MPU XEON 0.13UM 2GHZ 603-PIN UFCBGA - Trays
RN80532KC041512 SL6EM	制造商:Intel 功能描述:MPU XEON 0.13UM 2GHZ 603-PIN UFCBGA - Trays
RN80532KC041512S L5Z9	制造商:Intel 功能描述:MPU Xeon? Processor 0.13um 2GHz 603-Pin uFCBGA
RN80532KC041512S L6W6	制造商:Intel 功能描述:MPU Xeon? Processor 0.13um 2GHz 603-Pin uFCBGA

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