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参数资料
型号： RN80532KC0412M
厂商： INTEL CORP
元件分类： 微控制器/微处理器
英文描述： 2000 MHz, MICROPROCESSOR, CPGA603
封装： Interposer, Micro, PGA-603
文件页数： 33/132页
文件大小： 2316K
代理商： RN80532KC0412M
30
Intel Confidential
Working page only. Do not distribute.
6Features.................................................................................................................6-1
6.1
Power-On Configuration Options..................................................................6-1
6.2
Clock Control and Low Power States ...........................................................6-1
6.2.1
Normal State—State 1 .....................................................................6-1
6.2.2
AutoHALT Powerdown State—State 2 ............................................6-1
6.2.3
Stop-Grant State—State 3 ...............................................................6-2
6.2.4
HALT/Grant Snoop State—State 4 ..................................................6-3
6.2.5
Sleep State—State 5 .......................................................................6-3
6.2.6
Bus Response during Low Power States.........................................6-4
6.3
Thermal Monitor............................................................................................6-4
6.3.1
Thermal Diode .................................................................................6-4
6.4
System Management Bus (SMBus) Interface...............................................6-5
6.4.1
Processor Information ROM (PIROM) .............................................6-6
6.4.2
Scratch EEPROM ............................................................................6-8
6.4.3
PIROM and Scratch EEPROM Supported SMBus Transactions.....6-8
6.4.4
SMBus Thermal Sensor...................................................................6-8
6.4.5
Thermal Sensor Supported SMBus Transactions............................6-9
6.4.6
SMBus Thermal Sensor Registers.................................................6-11
6.4.6.1 Thermal Reference Registers ...........................................6-11
6.4.6.2 Thermal Limit Registers ....................................................6-11
6.4.6.3 Status Register .................................................................6-11
6.4.6.4 Configuration Register ......................................................6-12
6.4.6.5 Conversion Rate Registers ...............................................6-13
6.4.7
SMBus Thermal Sensor Alert Interrupt ..........................................6-13
6.4.8
SMBus Device Addressing ............................................................6-13
7
Boxed Processor Specifications.................................................................7-1
7.1
Introduction ...................................................................................................7-1
7.2
Mechanical Specifications ............................................................................7-2
7.2.1
Boxed Processor Heatsink Dimensions...........................................7-2
7.2.2
Boxed Processor Heatsink Weight ..................................................7-2
7.2.3
Boxed Processor Retention Mechanism and Heatsink Supports ....7-2
7.3
Boxed Processor Requirements ...................................................................7-5
7.3.1
Intel Xeon Processor MP on the 0.13 Micron Process Processor ..
.........................................................................................................7-5
7.4
Thermal Specifications .................................................................................7-5
7.4.1
Boxed Processor Cooling Requirements .........................................7-5
8
Debug Tools Specifications ..........................................................................8-1
8.1
Logic Analyzer Interface (LAI) ......................................................................8-1
8.1.1
Mechanical Considerations..............................................................8-1
8.1.2
Electrical Considerations .................................................................8-1
9
Pin Listing and Signal Definitions ..............................................................9-1
9.1
Intel Xeon Processor MP on the 0.13 Micron Process Processor Pin As-
signments .....................................................................................................9-1
9.1.1
Pin Listing by Pin Number .............................................................9-10
9.2
Signal Definitions ........................................................................................9-19
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相关代理商/技术参数
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RN80532KC041512 制造商:Intel 功能描述:TRAY XEON 2.0GHZ 400MZH FSB - Trays 制造商:Rochester Electronics LLC 功能描述:- Bulk
RN80532KC041512 SL5Z9 制造商:Intel 功能描述:MPU XEON 0.13UM 2GHZ 603-PIN UFCBGA - Trays
RN80532KC041512 SL6EM 制造商:Intel 功能描述:MPU XEON 0.13UM 2GHZ 603-PIN UFCBGA - Trays
RN80532KC041512S L5Z9 制造商:Intel 功能描述:MPU Xeon? Processor 0.13um 2GHz 603-Pin uFCBGA
RN80532KC041512S L6W6 制造商:Intel 功能描述:MPU Xeon? Processor 0.13um 2GHz 603-Pin uFCBGA
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