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参数资料
| 型号： | RN80532KC0412M |
| 厂商： | INTEL CORP |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 2000 MHz, MICROPROCESSOR, CPGA603 |
| 封装： | Interposer, Micro, PGA-603 |
| 文件页数： | 86/132页 |
| 文件大小： | 2316K |
| 代理商： | RN80532KC0412M |
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Intel Xeon Processor MP with up to 2MB L3 Cache
4-1
Mechanical Specifications
Mechanical Specifications
4
The Intel Xeon processor MP on the 0.13 micron process processor uses a Micro-Pin Grid Array
(INT-mPGA) packaging technology. The Intel Xeon processor with 512-KB of L2 cache uses the
INT-mPGA package for 400 MHz system bus processors and the Flip Chip Micro-Pin Grid Array
(FC-mPGA2) package for 533 MHz system bus processors. In addition, the Low Voltage Intel
Xeon processor uses the Flip Chip Micro-Pin Grid Array (FC-mPGA2) package for 400 MHz
system bus processors. Both packages include an integrated heat spreader (IHS). The Intel Xeon
processor MP on the 0.13 micron process and the Intel Xeon processor in INT-mPGA package
include the processor die, and a pinned FR4 interposer. The Intel Xeon processor in the FC-
mPGA2 package contains the processor die but no interposer, PIROM or scratch EEPROM.
Mechanical specifications for the processor are given in this section. See Section 1.1 for
includes the components which make up the entire processor. The Intel Xeon processor MP on the
0.13 micron process processor and the Intel Xeon processor in INT-mPGA package also includes
several SMBus components on the package interposer, an EEPROM, and a thermal sensor.
Table 29 provides dimensions for the package shown in Figure 28. These dimensions describe a
high thermal performance package for use on the Intel Xeon processor MP on the 0.13 micron
process processor. A thermal performance benefit is expected from the use of an IHS with an
increase in thickness from 1.5 mm to 3.0 mm. This results in a change from the Intel Xeon
processor package configuration.
The Intel Xeon processor MP on the 0.13 micron process processor and the Intel Xeon processor in
INT-mPGA utilize a surface mount 603-pin zero-insertion force (ZIF) socket for installation into
the baseboard. Please refer to the 603- Pin Socket Design Guidelines for further details on the
processor socket. The Intel Xeon processor in the FC-mPGA2 package utilizes a surface mount
604-pin zero-insertion force (ZIF) socket for installation into the baseboard. The 604-pin socket is
required to accommodate the solder fillet on the FC-mPGA2 package pins. Please refer to the 604-
Pin Socket Design Guidelines for further details on the processor socket. Note that Intel Xeon
processor in INT-mPGA package can utilize the 604-pin socket.
Note:
For Figure 26 through Figure 37, the following notes apply:
1. Unless otherwise specified, the following drawing dimensions are expressed in millimeters.
2. Currently, all mechanical specifications are preliminary and subject to change.
3. Figures and drawings labelled as “Reference Dimensions” are provided for informational
purposes only. Reference Dimensions are extracted from the mechanical design database and
are nominal dimensions with no tolerance information applied. Reference Dimensions are
NOT checked as part of the processor manufacturing process. Unless noted as such,
dimensions in parentheses without tolerances are Reference Dimensions.
4. The Intel Xeon processor MP on the 0.13 micron process processor will utilize a 42.5 mm
INT-mPGA package and for the purpose of this section will be referred to as the “Xeon MP
package.” The Intel Xeon processor will use a 35 mm INT-mPGA or 31 mm for the FC-
mPGA2 package. The differences between these packages include the package dimensions
and the IHS dimensions. Thermal solutions should be designed to support both packages and
their associated IHS sizes. See the Intel
Xeon Processor (MP) Thermal Design Guidelines
for additional details on thermal solution design.
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相关代理商/技术参数 |
参数描述 |
|---|---|
| RN80532KC041512 | 制造商:Intel 功能描述:TRAY XEON 2.0GHZ 400MZH FSB - Trays 制造商:Rochester Electronics LLC 功能描述:- Bulk |
| RN80532KC041512 SL5Z9 | 制造商:Intel 功能描述:MPU XEON 0.13UM 2GHZ 603-PIN UFCBGA - Trays |
| RN80532KC041512 SL6EM | 制造商:Intel 功能描述:MPU XEON 0.13UM 2GHZ 603-PIN UFCBGA - Trays |
| RN80532KC041512S L5Z9 | 制造商:Intel 功能描述:MPU Xeon? Processor 0.13um 2GHz 603-Pin uFCBGA |
| RN80532KC041512S L6W6 | 制造商:Intel 功能描述:MPU Xeon? Processor 0.13um 2GHz 603-Pin uFCBGA |
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