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参数资料
型号： RN80532KC0412M
厂商： INTEL CORP
元件分类： 微控制器/微处理器
英文描述： 2000 MHz, MICROPROCESSOR, CPGA603
封装： Interposer, Micro, PGA-603
文件页数： 34/132页
文件大小： 2316K
代理商： RN80532KC0412M
31
Intel Confidential
Working page only. Do not distribute.
1
Typical VCCIOPLL, VCCA and VSSA Power Distribution.................................... 2-4
2
Phase Lock Loop (PLL) Filter Requirements ........................................................... 2-5
3Intel Xeon Processor MP on the 0.13 Micron Process Processor Voltage-Current
Projections ............................................................................................................... 2-12
4
Electrical Test Circuit.............................................................................................. 2-22
5
TCK Clock Waveform ............................................................................................ 2-23
6
Differential Clock Waveform.................................................................................. 2-23
7
Differential Clock Crosspoint Specification ........................................................... 2-24
8
System Bus Common Clock Valid Delay Timing Waveform ................................ 2-24
9
System Bus Source Synchronous 2X (Address) Timing Waveform....................... 2-25
10
System Bus Source Synchronous 4X (Data) Timing Waveform ............................ 2-26
11
System Bus Reset and Configuration Timing Waveform ....................................... 2-27
12
Power-On Reset and Configuration Timing Waveform.......................................... 2-27
13
TAP Valid Delay Timing Waveform ...................................................................... 2-28
14
Test Reset (TRST#), Async GTL+ Input, and PROCHOT# Timing Waveform............
................................................................................................................................. 2-28
15
THERMTRIP# to Vcc Timing ................................................................................ 2-28
16
SMBus Timing Waveform ...................................................................................... 2-29
17
SMBus Valid Delay Timing Waveform.................................................................. 2-29
18
Example 3.3 Volt/SM_VCC Sequencing ................................................................ 2-30
19
FERR#/PBE# Valid Delay Timing ......................................................................... 2-31
20
BCLK[1:0] Signal Integrity Waveform..................................................................... 3-2
21
Low-to-High System Bus Receiver Ringback Tolerance for AGTL+ and Asynchro-
nous GTL+ Buffers ................................................................................................... 3-3
22
High-to-Low System Bus Receiver Ringback Tolerance for AGTL+ and Asynchro-
nous GTL+ Buffers ................................................................................................... 3-3
23
Low-to-High System Bus Receiver Ringback Tolerance for PWRGOOD and TAP
Buffers ....................................................................................................................... 3-4
24
High-to-Low System Bus Receiver Ringback Tolerance for PWRGOOD and TAP
Buffers ....................................................................................................................... 3-5
25
Maximum Acceptable Overshoot/Undershoot Waveform ...................................... 3-10
26
Intel
Xeon Processor MP on the 0.13 Micron Process Processor and Intel Xeon
Processor with 512-KB L2 Cache in INT-mPGA Package - Assembly Drawing (In-
cluding Socket).......................................................................................................... 4-2
27
Intel Xeon Processor MP on the 0.13 Micron Process Processor Package Top View
Component Placement Detail .................................................................................... 4-3
28
Intel
Xeon Processor MP on the 0.13 Micron Process Processor Package Drawing
4-3
29
Intel Xeon Processor MP on the 0.13 Micron Process Processor Top View - Com-
ponent Keep-In .......................................................................................................... 4-5
30
Intel Xeon Processor MP on the 0.13 Micron Process Processor and Intel Xeon
Processor with 512-KB L2 Cache in INT-mPGA Package - Cross Section View - Pin
Side Component Keep-In .......................................................................................... 4-5
31
Intel Xeon Processor MP on the 0.13 Micron Process Processor and Intel Xeon
Processor with 512-KB L2 Cache in INT-mPGA Package - Processor Pin Details . 4-6
32
Intel Xeon Processor MP on the 0.13 Micron Process Processor Package IHS Flat-
ness and Tilt Drawing................................................................................................ 4-7
33
Intel Xeon Processor MP on the 0.13 Micron Process INT-mPGA Package IHS
Flatness and Tilt Drawing ......................................................................................... 4-7
34
Intel Xeon Processor MP on the 0.13 Micron Process Processor Top-Side Markings
(Package Example).................................................................................................... 4-9
35
Intel Xeon Processor MP on the 0.13 Micron Process Processor Bottom-Side
Markings (Package Example).................................................................................. 4-10
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相关代理商/技术参数
参数描述
RN80532KC041512 制造商:Intel 功能描述:TRAY XEON 2.0GHZ 400MZH FSB - Trays 制造商:Rochester Electronics LLC 功能描述:- Bulk
RN80532KC041512 SL5Z9 制造商:Intel 功能描述:MPU XEON 0.13UM 2GHZ 603-PIN UFCBGA - Trays
RN80532KC041512 SL6EM 制造商:Intel 功能描述:MPU XEON 0.13UM 2GHZ 603-PIN UFCBGA - Trays
RN80532KC041512S L5Z9 制造商:Intel 功能描述:MPU Xeon? Processor 0.13um 2GHz 603-Pin uFCBGA
RN80532KC041512S L6W6 制造商:Intel 功能描述:MPU Xeon? Processor 0.13um 2GHz 603-Pin uFCBGA
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