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参数资料
| 型号： | RN80532KC0412M |
| 厂商： | INTEL CORP |
| 元件分类： | 微控制器/微处理器 |
| 英文描述： | 2000 MHz, MICROPROCESSOR, CPGA603 |
| 封装： | Interposer, Micro, PGA-603 |
| 文件页数： | 130/132页 |
| 文件大小： | 2316K |
| 代理商： | RN80532KC0412M |
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Intel Xeon Processor MP with up to 2MB L3 Cache
8-1
Debug Tools Specifications
Debug Tools Specifications
8
The Debug Port design information has been moved. This includes all information necessary to
develop a Debug Port on this platform, including electrical specifications, mechanical
requirements, and all In-Target Probe (ITP) signal layout guidelines. Please reference the ITP700
Debug Port Design Guide for the design of your platform.
Note:
This change is effective for all future processors.
8.1
Logic Analyzer Interface (LAI)
Intel is working with two logic analyzer vendors to provide logic analyzer interfaces (LAIs) for use
in debugging systems. Tektronix and Agilent should be contacted to get specific information about
their logic analyzer interfaces. The following information is general in nature. Specific information
must be obtained from the logic analyzer vendor.
Due to the complexity of systems, the LAI is critical in providing the ability to probe and capture
system bus signals. There are two sets of considerations to keep in mind when designing a system
that can make use of an LAI: mechanical and electrical.
8.1.1
Mechanical Considerations
The LAI is installed between the processor socket and the processor. The LAI pins plug into the
socket, while the processor pins plug into a socket on the LAI. Cabling that is part of the LAI
egresses the system to allow an electrical connection between the processor and a logic analyzer.
The maximum volume occupied by the LAI, known as the keepout volume, as well as the cable
egress restrictions, should be obtained from the logic analyzer vendor. System designers must
make sure that the keepout volume remains unobstructed inside the system. Note that it is possible
that the keepout volume reserved for the LAI may differ from the space normally occupied by the
processor heatsink. If this is the case, the logic analyzer vendor will provide a cooling solution as
part of the LAI.
8.1.2
Electrical Considerations
The LAI will also affect the electrical performance of the system bus; therefore, it is critical to
obtain electrical load models from each of the logic analyzers to be able to run system level
simulations to prove that their tool will work in the system. Contact the logic analyzer vendor for
electrical specifications and load models for the LAI solution they provide.
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PDF描述 |
|---|---|
| RN80532KC041512 | 32-BIT, 2000 MHz, MICROPROCESSOR, CPGA603 |
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| RP65C02G-06 | 8-BIT, 6 MHz, MICROPROCESSOR, PDIP40 |
| RPIXP2800BC | 32-BIT, 650 MHz, RISC PROCESSOR, PBGA1356 |
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相关代理商/技术参数 |
参数描述 |
|---|---|
| RN80532KC041512 | 制造商:Intel 功能描述:TRAY XEON 2.0GHZ 400MZH FSB - Trays 制造商:Rochester Electronics LLC 功能描述:- Bulk |
| RN80532KC041512 SL5Z9 | 制造商:Intel 功能描述:MPU XEON 0.13UM 2GHZ 603-PIN UFCBGA - Trays |
| RN80532KC041512 SL6EM | 制造商:Intel 功能描述:MPU XEON 0.13UM 2GHZ 603-PIN UFCBGA - Trays |
| RN80532KC041512S L5Z9 | 制造商:Intel 功能描述:MPU Xeon? Processor 0.13um 2GHz 603-Pin uFCBGA |
| RN80532KC041512S L6W6 | 制造商:Intel 功能描述:MPU Xeon? Processor 0.13um 2GHz 603-Pin uFCBGA |
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