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参数资料
型号： RN80532KC0412M
厂商： INTEL CORP
元件分类： 微控制器/微处理器
英文描述： 2000 MHz, MICROPROCESSOR, CPGA603
封装： Interposer, Micro, PGA-603
文件页数： 50/132页
文件大小： 2316K
代理商： RN80532KC0412M
Electrical Specifications
2-10
Intel Xeon Processor MP with up to 2MB L3 Cache
input buffers. Legacy output FERR#/PBE# and other non-AGTL+ signals IERR#, THERMTRIP#
and PROCHOT# utilize GTL+ output buffers. All of these asynchronous GTL+ signals follow the
same DC requirements as AGTL+ signals, however the outputs are not driven high (during the
logical 0-to-1 transition) by the processor (the major difference between GTL+ and AGTL+).
Asynchronous GTL+ signals do not have setup or hold time specifications in relation to
BCLK[1:0]. However, all of the asynchronous GTL+ signals are required to be asserted for at least
two BCLKs in order for the processor to recognize them. See Table 11 and Table 18 for the DC
and AC specifications for the asynchronous GTL+ signal groups.
SMBus signals are derived from components mounted on the processor interposer along with the
processor silicon. The required SM_VCC for these signals is 3.3 V. See Section 6.4 for further
details.
2.10
Maximum Ratings
Table 6 lists the processor’s maximum environmental stress ratings. Functional operation at the
absolute maximum and minimum is neither implied nor guaranteed. The processor should not
receive a clock while subjected to these conditions. Functional operating parameters are listed in
the AC and DC tables. Extended exposure to the maximum ratings may affect device reliability.
Furthermore, although the processor contains protective circuitry to resist damage from static
electric discharge, one should always take precautions to avoid high static voltages or electric
fields.
NOTES:
1. This rating applies to any pin of the processor.
2. Contact Intel for storage requirements in excess of one year.
2.11
Processor DC Specifications
The processor DC specifications in this section are defined at the processor core (pads) unless
noted otherwise. See for the Intel Xeon processor MP on the 0.13 micron process processor pin
listings and Section 9.2 for the signal definitions. The voltage and current specifications for all
versions of the processor are detailed in Table 6. For platform planning refer to Figure 3. Notice
that the graphs include Thermal Design Power (TDP) associated with the maximum current levels.
The DC specifications for the AGTL+ signals are listed in Table 9.
Table 6.
Processor Absolute Maximum Ratings
Symbol
Parameter
Min
Max
Unit
Notes
TSTORAGE
Processor storage temperature
–40
85
°C
2
VCC
Any processor supply voltage with
respect to VSS
–0.3
1.75
V
1
VinAGTL+
AGTL+ buffer DC input voltage with
respect to VSS
–0.1
1.75
V
VinGTL+
Async GTL+ buffer DC input voltage
with respect to Vss
-0.1
1.75
V
VinSMBus
SMBus buffer DC input voltage with
respect to Vss
-0.3
6.0
V
IVID
Max VID pin current
5
mA
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相关代理商/技术参数
参数描述
RN80532KC041512 制造商:Intel 功能描述:TRAY XEON 2.0GHZ 400MZH FSB - Trays 制造商:Rochester Electronics LLC 功能描述:- Bulk
RN80532KC041512 SL5Z9 制造商:Intel 功能描述:MPU XEON 0.13UM 2GHZ 603-PIN UFCBGA - Trays
RN80532KC041512 SL6EM 制造商:Intel 功能描述:MPU XEON 0.13UM 2GHZ 603-PIN UFCBGA - Trays
RN80532KC041512S L5Z9 制造商:Intel 功能描述:MPU Xeon? Processor 0.13um 2GHz 603-Pin uFCBGA
RN80532KC041512S L6W6 制造商:Intel 功能描述:MPU Xeon? Processor 0.13um 2GHz 603-Pin uFCBGA
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