参数资料
型号: MT42L64M32D1KL-25 IT:A
厂商: Micron Technology Inc
文件页数: 61/164页
文件大小: 0K
描述: IC DDR2 SDRAM 2GBIT 168FBGA
标准包装: 1,000
格式 - 存储器: RAM
存储器类型: 移动 LPDDR2 SDRAM
存储容量: 2G(64M x 32)
速度: 400MHz
接口: 并联
电源电压: 1.14 V ~ 1.3 V
工作温度: -25°C ~ 85°C
封装/外壳: 168-WFBGA
供应商设备封装: 168-FBGA(12x12)
包装: 散装
2Gb: x16, x32 Mobile LPDDR2 SDRAM S4
Burst READ Command
Figure 36: Burst READ Followed by Burst WRITE – RL = 3, WL = 1, BL = 4
T0
T1
T2
T3
T4
T5
T6
T7
T8
CK#
CK
RL = 3
WL = 1
CA[9:0]
Bank n
col addr
Col addr
Bank n
col addr
Col addr
CMD
READ
NOP
NOP
NOP
NOP
NOP
WRITE
NOP
NOP
DQS#
DQS
t DQSCK
BL/2
t DQSSmin
DQ
D OUT A0
D OUT A1
D OUT A2
D OUT A3
D IN A0
D IN A1
D
Transitioning data
The minimum time from the burst READ command to the burst WRITE command is
defined by the read latency (RL) and the burst length (BL). Minimum READ-to-WRITE
latency is RL + RU( t DQSCK(MAX)/ t CK) + BL/2 + 1 - WL clock cycles. Note that if a READ
burst is truncated with a burst TERMINATE (BST) command, the effective burst length
of the truncated READ burst should be used for BL when calculating the minimum
READ-to-WRITE delay.
Figure 37: Seamless Burst READ – RL = 3, BL = 4, t CCD = 2
T0
T1
T2
T3
T4
T5
T6
T7
T8
CK#
CK
RL = 3
CA[9:0]
Bank n
col addr a
Col addr a
Bank n
col addr b
Col addr b
t CCD
=2
CMD
READ
NOP
READ
NOP
NOP
NOP
NOP
NOP
NOP
DQS#
DQS
DQ
D OUT A0
D OUT A1
D OUT A2
D OUT A3
D OUT B0
D OUT B1
D OUT B2
D OUT B3
Transitioning data
A seamless burst READ operation is supported by enabling a READ command at every
other clock cycle for BL = 4 operation, every fourth clock cycle for BL = 8 operation, and
PDF: 09005aef83f3f2eb
2gb_mobile_lpddr2_s4_g69a.pdf – Rev. N 3/12 EN
61
Micron Technology, Inc. reserves the right to change products or specifications without notice.
2010 Micron Technology, Inc. All rights reserved.
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