![](http://datasheet.mmic.net.cn/390000/MT48V4M32LFFC_datasheet_16823585/MT48V4M32LFFC_59.png)
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128Mb: x16, x32 Mobile SDRAM
MobileY95W_3V_F.p65 – Rev. F; Pub. 9/02
Micron Technology, Inc., reserves the right to change products or specifications without notice.
2002, Micron Technology, Inc.
128Mb: x16, x32
MOBILE SDRAM
ADVANCE
54-BALL VFBGA (8mm x 9mm)
NOTE:
1. All dimensions in millimeters.
2. Package width and length do not include mold protrusion; allowable mold protrusion is 0.25mm per side.
BALL A1
0.80
TYP
BALL A9
BALL
A1 ID
54X
0.35
SOLDER BALL DIAMETER
REFERS TO POST REFLOW
CONDITION. THE PRE-
REFLOW DIAMETER IS 0.33
0.80
TYP
6.40
0.70 ±0.075
SEATING PLANE
C
0.08 C
1.0 MAX
MOLD COMPOUND: EPOXY NOVOLAC
SUBSTRATE: PLASTIC LAMINATE
SOLDER BALL MATERIAL: EUTECTIC 63% Sn, 37% Pb or
62% Sn, 36% Pb, 2%Ag
SOLDER BALL PAD: .27mm
4.00 ±0.05
3.20 ±0.05
3.20 ±0.05
8.00 ±0.10
BALL A1 ID
4.50 ±0.05
9.00 ±0.10
6.40
C
L
C
L