参数资料
型号: FSBB15CH60C
厂商: Fairchild Semiconductor
文件页数: 51/64页
文件大小: 0K
描述: IC POWER MOD SPM 600V SPM27CC
标准包装: 10
系列: SPM™
类型: IGBT
配置: 3 相
电流: 15A
电压: 600V
电压 - 隔离: 2500Vrms
封装/外壳: SPM27CC
产品目录页面: 1223 (CN2011-ZH PDF)
Mini DIP (SPM3) Application Note (2012-07-09)
record the SPM surface temperature. Although there is no stipulation on the thermocouple location on which
the reference temperature ( T c here) needs to be measured, it is recommended that the ideal location is the
hottest point. In this note, the SPM center or the heat sink center was chosen.
The thermocouple needs to make a good thermal contact with its reference location. Thermal grease
and appropriate clamping pressure are needed as shown in Fig. 9.7.
9.3 Temperature Rise Considerations and Calculation Example
The result of loss calculation using the typical characteristics is shown in Figure 9.8 as “Effective
current versus carrier frequency characteristics”. The conditions are follows.
Conditions : V PN =300V, V CC =V BS =15V, V CE(sat) =typical, Switching loss=typical, Tj=150 ? C, Tc=125 ? C,
Rth(j-c) = Max., M.I.=1.0, P.F=0.8, 3-phase continuous PWM modulation, 60Hz sine waveform output.
100
10
FSBB30CH60C
FSBB20CH60C
FSBB15CH60C
FSBF15CH60BT
1
FSBF10CH60B
1
2
3
4
5
6
7 8 9 10
20
30
Switching Frequency F SW [kHz]
Figure 9.8 Effective current - carrier frequency characteristics
Note:
The above characteristics may vary in the different control schemes and motor drive types.
Figure 9.8 indicates an example of an inverter operated under the condition of Tc=125 ? C. It indicates
the effective current Io which can be outputted when the junction temperature Tj rises to the average junction
temperature of 150 ? C (up to which the Mini DIP SPM operates safely).
? 2008
FAIRCHILD SEMICONDUCTOR - Smart Power Module
51
相关PDF资料
PDF描述
FSBB15CH60F MODULE SPM 600V SPM27-CA
FSBB20CH60CL SMART POWER MODULE 20A SPM27-CB
FSBB20CH60CT MODULE ADV MOTION SPM SPM27-CC
FSBB20CH60C MODULE MOTION-SPM 600V SPM27-CC
FSBB20CH60SL MODULE SPM 600V 20A SPM27-CA
相关代理商/技术参数
参数描述
FSBB15CH60C 制造商:Fairchild Semiconductor Corporation 功能描述:Transistor
FSBB15CH60F 功能描述:IGBT 晶体管 600V SPM RoHS:否 制造商:Fairchild Semiconductor 配置: 集电极—发射极最大电压 VCEO:650 V 集电极—射极饱和电压:2.3 V 栅极/发射极最大电压:20 V 在25 C的连续集电极电流:150 A 栅极—射极漏泄电流:400 nA 功率耗散:187 W 最大工作温度: 封装 / 箱体:TO-247 封装:Tube
FSBB20CH60 功能描述:IGBT 模块 HIGH_POWER RoHS:否 制造商:Infineon Technologies 产品:IGBT Silicon Modules 配置:Dual 集电极—发射极最大电压 VCEO:600 V 集电极—射极饱和电压:1.95 V 在25 C的连续集电极电流:230 A 栅极—射极漏泄电流:400 nA 功率耗散:445 W 最大工作温度:+ 125 C 封装 / 箱体:34MM 封装:
FSBB20CH60B 功能描述:IGBT 模块 600V -20A 3-phase RoHS:否 制造商:Infineon Technologies 产品:IGBT Silicon Modules 配置:Dual 集电极—发射极最大电压 VCEO:600 V 集电极—射极饱和电压:1.95 V 在25 C的连续集电极电流:230 A 栅极—射极漏泄电流:400 nA 功率耗散:445 W 最大工作温度:+ 125 C 封装 / 箱体:34MM 封装:
FSBB20CH60BT 功能描述:IGBT 模块 600V -20A 3-phase RoHS:否 制造商:Infineon Technologies 产品:IGBT Silicon Modules 配置:Dual 集电极—发射极最大电压 VCEO:600 V 集电极—射极饱和电压:1.95 V 在25 C的连续集电极电流:230 A 栅极—射极漏泄电流:400 nA 功率耗散:445 W 最大工作温度:+ 125 C 封装 / 箱体:34MM 封装: