参数资料
型号: IDT88P8341BHGI
厂商: IDT, Integrated Device Technology Inc
文件页数: 16/96页
文件大小: 0K
描述: IC SPI3-SPI4 EXCHANGE 820-PBGA
标准包装: 24
系列: *
其它名称: 88P8341BHGI
23
IDT88P8341 SPI EXCHANGE SPI-3 TO SPI-4
INDUSTRIALTEMPERATURERANGE
APRIL 10, 2006
4. DATAPATH AND FLOW CONTROL
The following sections describe the datapaths through the device. The
datapaths shown are as follows:
- SPI-3A <-> SPI-4
- SPI-3A <-> microprocessor interface
- SPI-4 <-> microprocessor interface
Where <-> indicates a bidirectional data path.
TheIDT88P8341supportsoneSPI-3interfaceandoneSPI-4interface.The
SPI-3interfacecanoperateinaPHYorLinkmode.RefertoFigure11, Definition
of Data Flows for the main data flows in the device. Logical data flows are
transported over the physical ports. The logical flows are identified by logical
port addresses on the physical port and by a Link identification (LID) map in the
core of the IDT88P8341.
DATA BUFFER ALLOCATION
Flexibilityhasbeenprovidedtotheuserfordatabufferallocation.Thedevice
has 128 KByte of on chip memory per direction – a total of 256 KByte of on-chip
data memory.
The 128 KByte SPI-3 buffers are divided into 256 byte segments. The
segments are controlled by a packet fragment processor. The user configures
the maximum number of segments per LP to allocate to a port and the number
ofsegmentsallocatedfromthebuffersegmentpoolthatwilltriggertheflowcontrol
mechanism.Thereisnolimitationonthereallocationoffreedsegmentsamong
logicalports,aswouldbepresentifthememoryhadbeenallocatedbyasimple
addressmechanism.
Figure 11. Definition of data flows
6372 drw12
SPI-3 physical port
SPI-4
to SPI-3
from SPI-3
to SPI-4
from SPI-4
SPI-3 egress
SPI-3 ingress
SPI-4 ingress
SPI-4 egress
SPI-3-4 path
SPI-4-3 path
physical
port
SPI-3 extract
SPI-3 insert
SPI-4 insert
SPI-4 extract
相关PDF资料
PDF描述
LFEC15E-4FN484C IC FPGA 10.2KLUTS 288I/O 484-BGA
IDT72V51446L7-5BBI IC FLOW CTRL MULTI QUEUE 256-BGA
LFEC15E-4F484C IC FPGA 10.2KLUTS 288I/O 484-BGA
LT3022IMSE-1.8#TRPBF IC REG LDO 1.8V 1A 16-MSOP
LT3022IMSE-1.5#TRPBF IC REG LDO 1.5V 1A 16-MSOP
相关代理商/技术参数
参数描述
IDT88P8341BHI 功能描述:IC SPI3-SPI4 EXCHANGE 820-PBGA RoHS:否 类别:集成电路 (IC) >> 专用 IC 系列:* 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:1 系列:- 类型:调帧器 应用:数据传输 安装类型:表面贴装 封装/外壳:400-BBGA 供应商设备封装:400-PBGA(27x27) 包装:散装
IDT88P8342BHGI 功能描述:IC SPI3-SPI4 EXCHANGE 820-PBGA RoHS:是 类别:集成电路 (IC) >> 专用 IC 系列:* 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:1 系列:- 类型:调帧器 应用:数据传输 安装类型:表面贴装 封装/外壳:400-BBGA 供应商设备封装:400-PBGA(27x27) 包装:散装
IDT88P8342BHI 功能描述:IC SPI3-SPI4 EXCHANGE 820-PBGA RoHS:否 类别:集成电路 (IC) >> 专用 IC 系列:* 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:1 系列:- 类型:调帧器 应用:数据传输 安装类型:表面贴装 封装/外壳:400-BBGA 供应商设备封装:400-PBGA(27x27) 包装:散装
IDT88P8344 制造商:IDT 制造商全称:Integrated Device Technology 功能描述:SPI EXCHANGE 4 x SPI-3 TO SPI-4 Issue 1.0
IDT88P8344BHGI 功能描述:IC SPI3-SPI4 EXCHANGE 820-PBGA RoHS:是 类别:集成电路 (IC) >> 专用 IC 系列:* 产品培训模块:Lead (SnPb) Finish for COTS Obsolescence Mitigation Program 标准包装:1 系列:- 类型:调帧器 应用:数据传输 安装类型:表面贴装 封装/外壳:400-BBGA 供应商设备封装:400-PBGA(27x27) 包装:散装